Stellar Industries Corp.’s Post

The necessity of edge profiler and its detection product - silicon wafer formation. Single crystal straightening is a common method of wafer production, rotating the molten silicon to form a cylindrical silicon ingot, and then the silicon ingot is cut by diamond wire into a silicon wafer, which is often said to be "wafer". After the silicon ingot is cut into the wafer, the Edge of the wafer needs to be chamfered with the grinding wheel. The chamfering outline is called edge. The purpose of chamfering is mainly three :1. Prevent wafer edge fragmentation 2. Prevent thermal stress concentration 3. Increase the flatness of epitaxial layer and photoresist layer at wafer edge. The contour shape of the chamfer is a very important parameter in wafer fabrication, so the measurement of wafer edge measurement system is an essential step in wafer fabrication. #Wafer##silicon wafer##wafer edge measurement system#

Semiconductor Process Equipment Ceramic Parts - ESD Material In semiconductor production, Electrostatic Discharge (ESD) poses a significant challenge, particularly due to advancements in technology and the ongoing trend of miniaturization. There is a growing need for electrostatic discharge-safe (ESD-safe) ceramics to protect fragile microelectronic components from potential permanent damage caused by the accumulation of static electricity. As depicted in the provided image, the selected material exhibits a specific Static Dissipative property, measured at 10⁹Ω. This characteristic designates it as Static Dissipative, emphasizing its ability to mitigate the effects of static electricity. Silicon Carbide (SiC) Color: Black  Compressive strength: 3900 MPa Volume Resistivity: 1x10^8 Ω.m Coefficient of Linear Thermal Expansion: 40~400°C 3.7 x 10-6/°C 40~800°C 4.4 x 10-6/°C https://lnkd.in/gCfr8dpr LONGYI  PRECISION  TECHNOLOGY  CO.,  LTD.   Address : No. 705, Longxing Road, Chungli District , 32091, Taoyuan, Taiwan Tel : 886-3-466-6611│Fax : 886-3-466-77 #advancedceramic #ESDmaterial #Semiconductorspareparts #Equipmentspareparts  

Wanna shake hands with our engineered ceramic? Featured below is an end effector which functions as the robot’s hand that moves semiconductor wafers between positions. End effectors must be dimensionally precise and rigid, while having a smooth, abrasion-resistant surface to safely handle wafers without producing particulate contamination. In some cases, electrostatic discharge-safe ceramics are used to prevent static buildup on the wafer surface. Learn more about CoorsTek end effectors at https://bit.ly/44FRnR4 and electrostatic discharge-safe ceramics at https://bit.ly/4bg7TKc. #Semiconductor #Innovation #TechnicalCeramics #EndEffector

Why Choose E-Fab for Your Tungsten Needs? For starters, tungsten isn't your average metal. The exceptional hardness translates to components that resist wear and tear, and it thrives in environments where other materials would fail due to its high melting point. Tungsten also allows for tight tolerances and intricate designs, crucial for high-precision manufacturing. It's the perfect choice for demanding applications across various industries, including aerospace, medical device, and electronics. While tungsten offers impressive advantages, its unique properties require specialized processing. That's where E-Fab's expertise in photochemical etching comes in. This technique lets us etch intricate tungsten components that deliver consistent performance under extreme conditions. If you're still wondering how tungsten can benefit your application, read our in-depth blog here! https://buff.ly/45Rpki7 #EFab #PhotochemicalEtching #Tungsten #Benefits #PrecisionManufacturing #HighPerformanceMaterials

[PDF] Dislocation dynamics during plastic deformation Ulrich Messerschmidt digsell https://lnkd.in/eKZ5dfaS 1. Introduction.- 2. Experimental methods.- 3. Properties of dislocations.- 4. Dislocation motion.- 5. Dislocation kinetics, work-hardening and recovery.- 6. Semiconductors.- 7. Ceramic single crystals.- 8. Metallic alloys.- 9. Intermetallic alloys.- 10. Quasicrystals.- 11. Conclusion https://lnkd.in/eDDfKF4G

What do you know about silicon nitride ceramics? This video introduced the features and applications of silicon nitride ceramics.

In this week's #FAQ, Kory Schroeder, Director of Marketing and Engineering at Stackpole Electronics, answers the question: "What are the main differences between thick film and thin film resistors?" Answer: As the names state, there are significant differences in the element thickness between thick film and thin film resistors.  Thin film elements are a sputtered metallic alloy that are typically only a thousand angstroms thick where thick film elements are a much thicker screen-printed ruthenium oxide paste material.  Thin film chip resistors can achieve much better TCR and absolute resistance tolerances because of their material uniformity and consistency as well as their calibration process, but generally have a more limited resistance value range. The significantly higher element material density, and the improved heat conduction of the thin film element all provide better precision, stability, and lower electrical noise with improved high frequency characteristics. Thick film resistors provide a lower cost, wider resistance range, and inherent moisture withstanding capability. Pulse handling for thin film is better for longer term pulses, but thick film resistors are better for short pulses of 0.0001 second and shorter. #resistors #worldofengineering

Indium (In) Sputtering Target Indium sputtering target is used to coat the bearings of high-speed motors because it can evenly distribute the lubricant. Indium targets are also used in thin film deposition, decoration, semiconductors, displays, LED and photovoltaic devices, functional coatings, and other optical information storage space industries, glass coating industries such as automotive glass and architectural glass, and optical communications. Indium is also used to make other electrical components such as rectifiers, thermistors and photoconductors. Indium can be used to make mirrors that have the same reflectivity as silver mirrors but will not fade. Indium is also used to make low melting point alloys. Related Sputtering Materials In2O3 sputtering target ln2Te3 sputtering target In2O3/SnO2 90/10wt% sputtering target InGaZnO4 sputtering target In2O3/ZnO 90/10wt% sputtering target

Unlock the Potential of Silicon Nitride Balls for Precision Applications Explore the world of Silicon Nitride Balls, where exceptional durability meets cutting-edge performance. Ideal for high-precision applications, these ceramic balls offer unparalleled hardness, wear resistance, and can withstand extreme environments, making them a perfect choice for industries aiming for the highest reliability and efficiency. Whether it’s enhancing the lifespan of bearings in aerospace or pushing the boundaries of grinding efficiency, Silicon Nitride Balls are transforming how we approach material challenges. #MaterialScience #SiliconNitrideballs #PrecisionEngineering #Aerospace #ManufacturingInnovation