Quanscient’s Post

Accurate design and optimization of the semiconductor fabrication process/equipment for yield improvements and faster time-to-market require multiphysics simulation, which can address various physical interactions and phenomena. #semiconductor #simulation #ansys #design #optimization #wafer #chip

Join us for the 2nd installment in our Semiconductor Manufacturing Webinar Series! Semiconductor manufacturing plays a pivotal role in our technological advancement, but it also comes with significant environmental impacts. As the demand for electronics continues to surge, it's imperative to prioritize sustainability measures to mitigate these effects. In this webinar, we'll delve into the application of Ansys tools to enhance sustainability in semiconductor manufacturing processes. Discover how simulation and modeling can optimize resource utilization, boost manufacturing efficiency, and minimize environmental impact. Key Takeaways: 🌱 Explore challenges in semiconductor manufacturing and the path to sustainability 🔬 Understand the role of simulations in addressing these challenges 💡 Learn critical applications where simulation can reduce carbon footprint Event details: Date & Time: THURSDAY, MAY 23, 2024 Register here➡️ https://ansys.me/4dQInwB Don't miss this opportunity to gain valuable insights and contribute to a greener future! Register now to secure your spot. #Ansys #eda #semiconductormanufacturing #multiphysics

The escalating intricacy of chip design, the impact of technology on national health and security, and sustainability demands have underscored the vital importance of high-tech manufacturing. Dive into our three-part webinar series to explore how Ansys simulation can tackle intricate manufacturing and sustainability hurdles. The first webinar in the series will showcase how #Ansys tools can be practically applied to comprehend the influence of different parameters on various wafer fabrication processes. It will also illustrate how these tools can be used to fine-tune processes, enhancing yields, and reducing wafer cycle time. Schedule:- Date & Time: Thursday, April 25th | 11:00 AM EST Register here: https://ansys.me/49I0FwS Don't wait and register today! #multiphysics #semiconductormanufacturing #ChipManufacturing

#Technology #Thread #Semiconductor #Manufacturing #Magazine The Semiconductor EPDT Magazine Article On Shift-Left: 1/ - Published In Electronic Product Design & Test [EPDT] Magazine's October Edition, The Insights On The Shift-Left Paradigm For Yield And Testing Strategies In Semiconductor Manufacturing. - Title: The Shift-Left Paradigm ---- 2/ - Shift-Left Testing In Semiconductor Manufacturing Helps Identify Defects Early, Reducing Development Costs And Improving Time-to-Market. - Early Testing Enables Defect Resolution Before Production, Where Resolution Costs Can Be 100x Higher. ---- 3/ - Key Elements Of Shift-Left Testing Include Design For Testability (DFT), Predictive Analytics, And Yield Optimization Techniques. - Integrating These Techniques In Early Development Stages Can Boost Production Efficiency And Reliability.   ---- 4/ - Advanced Simulation Tools Like SPICE And Monte Carlo Methods Enable Designers To Predict Yield And Testability Issues Before Physical Production Begins. - This Early Integration Minimizes Risks Associated With Late-Stage Defect Detection And Enhances Long-Term Device Reliability. ---- 5/ - Read More (Page 34-35): https://lnkd.in/ggKHvb4G ---- #chetanpatil - Chetan Arvind Patil - www.ChetanPatil.in

Join us for the 2nd installment in our Semiconductor Manufacturing Webinar Series! Semiconductor manufacturing plays a pivotal role in our technological advancement, but it also comes with significant environmental impacts. As the demand for electronics continues to surge, it's imperative to prioritize sustainability measures to mitigate these effects. In this webinar, we'll delve into the application of Ansys tools to enhance sustainability in semiconductor manufacturing processes. Discover how simulation and modeling can optimize resource utilization, boost manufacturing efficiency, and minimize environmental impact. Key Takeaways: 🌱 Explore challenges in semiconductor manufacturing and the path to sustainability 🔬 Understand the role of simulations in addressing these challenges 💡 Learn critical applications where simulation can reduce carbon footprint Event details: Date & Time: THURSDAY, MAY 23, 2024 Register here➡️ https://ansys.me/4dsRBiC Don't miss this opportunity to gain valuable insights and contribute to a greener future! Register now to secure your spot. #Ansys #eda #semiconductormanufacturing #multiphysics

The escalating intricacy of chip design, the impact of technology on national health and security, and sustainability demands have underscored the vital importance of high-tech manufacturing. Dive into our three-part webinar series to explore how Ansys simulation can tackle intricate manufacturing and sustainability hurdles. The first webinar in the series will showcase how #Ansys tools can be practically applied to comprehend the influence of different parameters on various wafer fabrication processes. It will also illustrate how these tools can be used to fine-tune processes, enhancing yields, and reducing wafer cycle time. Schedule:- Date & Time: Thursday, April 25th | 11:00 AM EST Register here: https://ansys.me/3xuijXv Don't wait and register today! #multiphysics #semiconductormanufacturing #ChipManufacturing

Curious about how Ansys tools can enhance wafer fabrication processes? Join me at our webinar on April 25th, 11:00 AM EST, where I'll be sharing practical insights, solutions, and examples on this topic. Secure your spot today by registering now!

The escalating intricacy of chip design, the impact of technology on national health and security, and sustainability demands have underscored the vital importance of high-tech manufacturing. Dive into our three-part webinar series to explore how Ansys simulation can tackle intricate manufacturing and sustainability hurdles. The first webinar in the series will showcase how #Ansys tools can be practically applied to comprehend the influence of different parameters on various wafer fabrication processes. It will also illustrate how these tools can be used to fine-tune processes, enhancing yields, and reducing wafer cycle time. Schedule:- Date & Time: Thursday, April 25th | 11:00 AM EST Register here: https://ansys.me/3xSVBIX Don't wait and register today! #multiphysics #semiconductormanufacturing #ChipManufacturing

The MAPT Roadmap. I echo Markus Kuhn's discussion about the MAPT Roadmap chapter covering Manufacturing and Process Development Metrology. The following message paraphrases Markus' post on LinkedIn concerning the MAPT. The Microelectronics and Advanced Packaging Technology (#MAPT) Roadmap, collaborating with industry, academia, and government partners. Manufacturing and Process Development Metrology is key part of the Foundational Ecosystem of silicon integrated circuits and associated technology. The MAPT roadmap sections focus on the challenges and opportunities we face in supporting sustainable growth and true innovation in the semiconductor industry. Read the Chapter 10 | Manufacturing and Process Development Metrology https://hubs.li/Q02hcY9Q0 The Manufacturing and Process Development Metrology chapter provides an overview of the characterization and metrology requirements for all areas of new devices and circuits to advanced packaging technology. The MAPT Roadmap also covers new materials as well as advanced packaging and heterogeneous integration and systems. It is worth noting that there are significant challenges and gaps in metrology and characterization capabilities to meet the future process development and manufacturing requirements in both the fab and packaging areas. The biggest takeaway from this experience is that success requires open-mindedness, alignment, and community. Activate to view larger image,

“Edge defects can be a major cause of wafer breakage in the fab, which disrupts the production line and can lead to very high cost.” 📣 Bruker’s John Wall (Compound Semi Business Product Manager), in the recent Semiconductor Engineering article entitled 𝘋𝘦𝘧𝘦𝘤𝘵 𝘊𝘩𝘢𝘭𝘭𝘦𝘯𝘨𝘦𝘴 𝘎𝘳𝘰𝘸 𝘈𝘵 𝘛𝘩𝘦 𝘞𝘢𝘧𝘦𝘳 𝘌𝘥𝘨𝘦. Defect management plays a critical role in the modern semiconductor manufacturing process. If wafers break due to undetected edge defects, it can result in the significant loss of product and time. Bruker’s solution types for defect management mentioned in the article are: · 𝗫-𝗿𝗮𝘆 𝗱𝗶𝗳𝗳𝗿𝗮𝗰𝘁𝗶𝗼𝗻 𝗶𝗺𝗮𝗴𝗶𝗻𝗴 (𝗫𝗥𝗗𝗜) – a technique that is sensitive to strain fields caused by even the smallest distortions in the crystalline lattice, like epilayer dislocations in Si/SiGe superlattice structures · 𝗪𝗵𝗶𝘁𝗲-𝗹𝗶𝗴𝗵𝘁 𝗶𝗻𝘁𝗲𝗿𝗳𝗲𝗿𝗼𝗺𝗲𝘁𝗿𝘆 (𝗪𝗟𝗜) – an optical profiling method that has a wide field of view plus high enough lateral and vertical sensitivity to characterize features like wafer edge roll off. · 𝗔𝘁𝗼𝗺𝗶𝗰 𝗳𝗼𝗿𝗰𝗲 𝗺𝗶𝗰𝗿𝗼𝘀𝗰𝗼𝗽𝘆 (𝗔𝗙𝗠) – a widely used topography and property metrology technique with a broad range of uses, including the evaluation of copper dishing during the CMP processes. 💬 Bruker experts who contributed to this article: John Wall, Samuel Lesko 📃 Read what they had to say in the full article: https://lnkd.in/gK2A6DG8