International Finance Magazine’s Post

🤝 MediaTek has teamed up with Ranovus for a ASIC design platform in the Heterogeneous Integration Co-Packaged Optics (CPO) field! 📢 As a result, semiconductor manufacturers may see increased demand for CPOs with optical-to-electrical conversion capabilities, making it a new focal point to see. 💡 Dive into more details around the collabration between MediaTek and Ranovus: https://buff.ly/3IIeIaR 🔗 #MediaTek #Ranovus

The performance of a handset antenna is simulated in XFdtd for varying hand hold positions on a device. Read or download the full example today! 🤳📱 #5G #MIMO #antenna #design #MobileDevice

Samsung Electronics expects tech device demand to revive in 2024 following unprecedented chip loss To know more about it read our full article here: https://lnkd.in/d_SbEGtX . . #cionews #cionewletter #innovations #technology #technologyrocks #technologyinnovation #artificialintelligence #artificialintelligenceai #informationtechnology #technologyinformation #fintech #fintechnews #financialservices #generativeai #aigenerative #virtualrealityworld #simulation #digitalaging

#UNISOC #T760 #6nm #5G #SoC announced in #India officially https://lnkd.in/gYxKdKwE UNISOC has officially introduced the T760 6nm 5G SoC in India, after it was introduced last year. It uses 6nm #EUV #process #technology and incorporates Arm’s 4 x A76 big 4 x A55 minor core architecture, along with an Arm #Mali-G57 #MC4 #GPU. It supports Hard Decode/4K@30fps encoding and decoding, and is compatible with #FHD #resolution #displays as well as 120Hz refresh rates. The company says that it has scored 510,000 points on #AnTuTu #V10. The UNISOC T760 boasts a dedicated #NPU with #AI computing power of 3.2 TOPS and has UNISOC’s latest #Vivimagic 6.0 imaging engine and Acutelogic 3A technology, supporting ultra-clear quad cameras with up to #64MP #pixels. | [Author: Srivatsan Sridhar] #technology #fonearena #Details: ⤵️ https://lnkd.in/gYxKdKwE

The integration of electronic chips in commercial devices has significantly evolved over the past decades, with engineers devising various integration strategies and solutions.

The integration of electronic chips in commercial devices has significantly evolved over the past decades, with engineers devising various integration strategies and solutions.

The integration of electronic chips in commercial devices has significantly evolved over the past decades, with engineers devising various integration strategies and solutions.

Thrilled to share a groundbreaking leap in memory technology 🚀: Samsung's new 3D DRAM lab in the US is shaping the future of computing with its innovative approach to data storage solutions. Here’s why this matters: 🔹 Pioneering in Silicon Valley, setting new benchmarks in the 3D DRAM space. 🔹 Aiming for unparalleled memory capacity and efficiency with sub-10nm technology. 🔹 Potential to transform server capabilities and consumer PC performance alike. This venture is not just a win for Samsung but a giant leap for the tech community. How do you see this impacting our digital future? Let's discuss it! 🔗Read the full article: https://lnkd.in/eT4Fq4Dx #Technology #Innovation #Samsung #3DDRAM #SiliconValley #DataStorage #Computing #TechCommunity #FutureTech #DigitalTransformation

🚀 The System-on-Chip (SoC) market is entering a period of rapid growth, driven by innovations in chiplet integration, advanced packaging, and AI-powered designs. With applications ranging from data centers to automotive, SoCs are reshaping the semiconductor industry. Our latest report highlights key trends in SoC design, the critical role of Silicon IP, and emerging opportunities across various sectors. Discover how these advancements are poised to fuel the market’s growth through 2025. Access the full report here 👉 https://bit.ly/3BcvGO7 #SystemOnChip #SemiconductorIndustry #ChipletTechnology #AdvancedPackaging #AIIntegration