Inmotive Inc.’s Post

Great article by Semiconductor Engineering's John W. Koon on chiplets in automotive with a quote by my colleague at Arteris', Guillaume Boillet. The article asks "Why Chiplets Are So Critical In Automotive?" Achieving chiplet interoperability is a competitive necessity, but it will require clearing a number of technical hurdles. "Many of us believe the dream of having an off-the-shelf, interoperable chiplet portfolio will likely take years before becoming a reality. Interoperability will emerge from groups of partners who are addressing the risk of incomplete specifications." Also part of the conversation were geoffrey tate at Flex Logix Technologies, Inc., David Fritz at Siemens Digital Industries Software, Arif Khan at Cadence Design Systems, Renesas Electronics' Vasanth Nanjundes waran, and David Ridgeway at Synopsys Inc. #Arteris #NetworkOnChip #Automotive #Chiplet https://bit.ly/3T5uWR6

Arm, ASE Global, BMW Group, Bosch, Cadence Design Systems, Siemens, SiliconAuto TW, Synopsys Inc, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program (ACP).   The global automotive ecosystem can now take part in imec's ACP. Uniting key automotive and semiconductor players in a pre-competitive setting to explore the opportunities created by chiplets, imec's ACP will promote shared innovation, expanding the benefits of chiplet technologies, including increased flexibility, better performance, and lower costs, into the automotive market.   Join the initiative and read the full press release: https://lnkd.in/dXpBQhyu   #ACP #imecACP #chiplets #ADA #IVI #ADAs #OEM #OEMs #Auto

Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent, and Valeo Join imec’s Automotive Chiplet Program. Today, at an exclusive gathering in Detroit, bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP). The program brings together stakeholders from across the automotive ecosystem in a pre-competitive research effort unparalleled in the car manufacturing industry. The program’s goal is to evaluate which chiplet architectures and packaging technologies are best suited to support car manufacturers’ specific high-performance computing and strict safety requirements, while striving to extend the benefits of chiplet technology – such as increased flexibility, improved performance and cost savings – to the entire automotive industry. https://lnkd.in/gjCwqaPx 鴻海精密工業股份有限公司 #AutomotiveChiplets #ChipletTechnology #HighPerformanceComputing #ADAS #InVehicleInfotainment #AutomotiveInnovation #ChipDesign #AutomotiveEcosystem #2D3DPackaging #SemiconductorIndustry #VehicleTechnology #ModularChips #EnergyEfficiency #AutomotiveSafety #AdvancedPackaging Photo Designed by Freepik

Press Release - Arm, ASE Global, BMW Group, Bosch, Cadence Design Systems, Siemens, SiliconAuto TW, Synopsys Inc, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program (ACP).   The global automotive ecosystem can now take part in imec's ACP. Uniting key automotive and semiconductor players in a pre-competitive setting to explore the opportunities created by chiplets, imec's ACP will promote shared innovation, expanding the benefits of chiplet technologies, including increased flexibility, better performance, and lower costs, into the automotive market.   Join the initiative and read the full press release: https://lnkd.in/dXpBQhyu   #ACP #imecACP #chiplets #ADA #IVI #ADAs #OEM #OEMs #Auto

I’m thrilled to share that my latest publication, Reliability Testing and Virtual Prototyping for Embedded GaN Power Modules in Automotive Applications, is now available! You can check it out here: https://lnkd.in/d2pfV9QM #Publication #Research #GaN #Semiconductor #Virtual_Prototyping

Top Five #Semiconductors Manufacturers 2Q24 Revenue... A summary by TrendForce Corporation China is still the biggest client for ASML equipment, accounting for almost 49% of revenue in 2Q24, which is a headache for the USA. Reports show that equipment manufacturers like ASML and TOKYO ELECTRON LIMITED can face stricter measures as the tech war intensifies between China and the US. Applied Materials showed an increase of 5.5% YoY in net sales ($6.8B), but on the other hand, ASML showed a decrease of 9.5% YoY in net sales, mainly due to slower demand for imersion DUV equiments. The highest YoY growth is posted by Tokyon Electron, 41.7%. All because of Chinese stock piling of #equipments. #Supplychains #manufacturing #ChinavsUS #Ammar

🥁Arm, BMW Group, Bosch, SiliconAuto, Siemens, Valeo, ASE, Cadence Design Systems, Synopsys Inc, Tenstorrent sign-up for imec "Automotive Chiplet Programme". 👉The programme brings together stakeholders from across the #automotive ecosystem in a pre-competitive research effort. 💡Aim is to evaluate which #chiplet architectures and #packaging #technologies are best suited to support car manufacturers for #highperformancecomputing with strict safety requirements. ❗Japan and Asia are already moving forwards with automotive chiplet design and manufacturing programmes. #sales #marketing

IPs 100 class, understand the IPs

Heterogeneous Integration using chiplet technology..

The article skimps over the fact that the lifecycle in the automotive industry is typically long because of the amount of effort required to qualify a process for any new product. If we still want reliable cars, then automotive standards have to be maintained, and until now, this requires a lot of testing/tuning and adjustment along the fabrication process. What we are seeing now, is other automotive standards coming from china, which are lighter and would allow minor tweaking of commercial grade chips to be used in automotive (which then indeed shorten the lifecycle). But the article is of course right on the trend. Chiplets are already widely used (just not in automotive), so the hard part will be to come with a standard for all these components. A lot of young startups are targeting this market, mostly offering integration of sensors with computer packages. Keep in mind that it took 10 years from the creation of CAN bus to it's recognition as an ISO standard. Before that, all the manufacturers had their own version (so own IP) of communicating with the ECU and the sensors. I can see that this will exactly follow the same path for the chiplets.