🌉 SEMICON West 2024 is just around the corner, and imec will present four key talks demonstrating imec's commitment to drive technological advancements and sustainability. Join us in San Francisco to explore: 1️⃣ Patterning Innovations and High-NA EUV Lithography Ru-Gun Liu, imec Vice President R&D and Fellow, will discuss imec's milestone achievement in demonstrating 10nm dense lines using High NA EUV lithography and the key innovations needed to push this technology to its limits. 2️⃣ Scaling AI Compute Through Advanced Silicon Photonics and 3D Technologies Filippo Jacopo Ferraro, imec Program Manager, will showcase how advancements in silicon photonics and 3D integration are enabling a 100x scaling of optical interconnect performance for high-performance AI systems. 3️⃣ Automotive Chiplet Alliance & Program at imec Kurt Herremans, imec Program Director Automotive, will present imec's initiatives to rally the automotive supply chain and collaboratively research solutions for chiplet-based automotive designs. 4️⃣ Material Circularity Throughout the Semiconductor Value Chain imec is driving the transition to a circular economy in the semiconductor industry. Emily Gallagher, Principal Member of Technical Staff, will showcase how imec is improving material circularity across the value chain. As a global hub of semiconductor industry collaboration, imec is at the forefront of driving innovation and addressing the challenges facing our industry. Join us at SEMICON West to discover how imec is stronger together with our partners in shaping the future of semiconductors. #SEMICONWest #Sustainability #Photonics #Automotive #Innovation SEMI Americas
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Imec and ASML Open High-NA EUV Lithography Lab to Accelerate Chip Manufacturing Semiconductor industry leaders imec and ASML have announced the opening of the High-NA EUV Lithography Lab in Veldhoven, Netherlands. This marks a significant milestone in bringing next-generation chip manufacturing to life. The Lab provides early access to the first-of-its-kind High-NA EUV scanner (TWINSCAN EXE:5000) for leading chipmakers and material suppliers. This will enable them to develop and test new processes before full-scale production begins in 2025-2026. High-NA EUV lithography is a critical technology for Moore's Law advancement. It allows for the creation of smaller, denser transistors, leading to more powerful and efficient chips. The Lab is a collaborative effort between imec and ASML, with contributions from ZEISS. It represents years of research and development to overcome technical challenges and establish a robust patterning ecosystem. This is a significant development for the semiconductor industry, paving the way for faster, more efficient chip production. https://lnkd.in/dWrNCBz5 #HighNAEUV #Lithography #ChipMaking #Semiconductors #Innovation #Collaboration #Photonics #PhotonicSpots #PhotonicsTimes
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Unlock the Executive Summary of the report at only USD 249. Book a call now: https://lnkd.in/dFh7dy2X Exploring the Future: Disruptors in the Extreme Ultraviolet Lithography Systems Market Hey LinkedIn fam! As we navigate the ever-evolving landscape of Electronics, Semiconductors, and Information & Communication Technology, let's take a moment to peek into the crystal ball and ponder on potential disruptors that might reshape the Extreme Ultraviolet Lithography (EUVL) Systems Market by 2029. In an era where innovation is the driving force, the semiconductor industry is no stranger to transformative shifts. Having been on this exciting journey, I can't help but marvel at the possibilities that lie ahead. The Lens of Disruption: What's on the Horizon? Imagine a world where Extreme Ultraviolet Lithography Systems redefine the very fabric of semiconductor manufacturing. Quantum leaps in technology, sustainable practices, and global collaboration are paving the way for groundbreaking disruptions. From my experience, staying ahead in this dynamic market requires a keen eye for emerging trends. Could advancements in nanotechnology, quantum computing, or even unexpected players entering the scene be the game-changers? Riding the Wave of Innovation: A Personal Insight Reflecting on my journey, I recall witnessing the impact of disruptive technologies firsthand. It's not just about the machines; it's about the people and the ideas that propel innovation forward. As we anticipate the future, it's clear that staying informed and fostering a collaborative spirit will be key. Share your experiences and thoughts in the comments – let's spark a dialogue on the potential disruptors that excite or concern you! Order your FREE Sample Report via https://lnkd.in/eVRexdt Let's turn this post into a melting pot of insights – drop your comments below and let's shape the future of Extreme Ultraviolet Lithography Systems together! ASML Canon Inc. SUSS MicroTec TSMC Toshiba Vistec Semiconductor Systems, Inc. Intel Corporation Nikon NuFlare Technology, Inc. Samsung Electronics #GlobalExtremeUltravioletLithographySystemsMarket #GlobalMarketEstimates #GME #TechTalks #FutureLeaders #InnovationJourney #TechInnovation #SemiconductorFuture #EUVLSystems #FutureTech
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𝐀𝐒𝐌𝐋'𝐬 𝐇𝐢𝐠𝐡-𝐍𝐀 𝐜𝐡𝐢𝐩𝐦𝐚𝐤𝐢𝐧𝐠 𝐭𝐨𝐨𝐥 𝐰𝐢𝐥𝐥 𝐜𝐨𝐬𝐭 $𝟑𝟖𝟎 𝐦𝐢𝐥𝐥𝐢𝐨𝐧 — 𝐭𝐡𝐞 𝐜𝐨𝐦𝐩𝐚𝐧𝐲 𝐚𝐥𝐫𝐞𝐚𝐝𝐲 𝐡𝐚𝐬 𝐨𝐫𝐝𝐞𝐫𝐬 𝐟𝐨𝐫 '𝟏𝟎 𝐭𝐨 𝟐𝟎' 𝐦𝐚𝐜𝐡𝐢𝐧𝐞𝐬 𝐚𝐧𝐝 𝐢𝐬 𝐫𝐚𝐦𝐩𝐢𝐧𝐠 𝐮𝐩 𝐩𝐫𝐨𝐝𝐮𝐜𝐭𝐢𝐨𝐧 Source: By Anton Shilov via Tom's Hardware (https://lnkd.in/gfXy44im) ASML has previously revealed that its next-generation High-NA extreme ultraviolet (#EUV) chipmaking tool would cost over twice as much as its existing Low-NA EUV #lithography tools, but didn't provide specifics. Now ASML has revealed that its High-NA #Twinscan EXE lithography machines will cost around $380 million (€350 million), reports Taipei Times. In contrast, existing Low-NA #Twinscan NXE EUV systems cost around €170 million ($183 million), though their prices depend on exact #models and configurations. Additionally, #ASML told Reuters that it has taken "10 to 20" orders to date from companies, including Intel Corporation and SK hynix, and plans to build 20 per year by 2028.
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This experimental facility is designed to delve into radiation-induced effects on #EUV optics and reticles. We're not just conducting research; we're pushing boundaries, developing modules, state-of-the-art research equipment, and groundbreaking strategies for contamination control in EUV lithography scanners. These scanners are the backbone of producing the world's most advanced #microchips. TNO metrology researchers focusing on resist related applications will be another complementary technology to help characterize defect, localized CD, roughness towards better understanding of the chemical interactions within this critical lithography process. #TNOSemicon #Metrology #IRAFM #Material #Characterisation #ADI #Unbiased #SEM #Complementary
Exciting News! We are thrilled to announce the deepening of our partnership with pioneering Japanese light innovator #Ushio Inc. Since 2015, Ushio has been a key strategic partner in the establishment of our Extreme Ultraviolet Lithography (EUV) exposure and analysis facility at our #high-tech research location in Delft. This experimental facility is designed to delve into radiation-induced effects on #EUV optics and reticles. We're not just conducting research; we're pushing boundaries, developing modules, state-of-the-art research equipment, and groundbreaking strategies for contamination control in EUV lithography scanners. These scanners are the backbone of producing the world's most advanced #microchips. We enable our clients to evaluate materials and components for NXE-relevant EUV radiation and environmental factors. To enhance service life, prevent contamination, and drive unprecedented advancements in #semicon equipment. The ink is dry on a brand-new five-year agreement. We couldn't be more proud to make this announcement on the eve of SEMI Japan, where groundbreaking advancements in semiconductor manufacturing take center stage. #TechnologyAdvancements #TNOSemicon Kazuya Aoki rob willekers Yoshihiko Sato Merijn Jacops Koji Yoshizawa Dirk van Baarle Kiyotada Nakamura
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Exciting News! We are thrilled to announce the deepening of our partnership with pioneering Japanese light innovator #Ushio Inc. Since 2015, Ushio has been a key strategic partner in the establishment of our Extreme Ultraviolet Lithography (EUV) exposure and analysis facility at our #high-tech research location in Delft. This experimental facility is designed to delve into radiation-induced effects on #EUV optics and reticles. We're not just conducting research; we're pushing boundaries, developing modules, state-of-the-art research equipment, and groundbreaking strategies for contamination control in EUV lithography scanners. These scanners are the backbone of producing the world's most advanced #microchips. We enable our clients to evaluate materials and components for NXE-relevant EUV radiation and environmental factors. To enhance service life, prevent contamination, and drive unprecedented advancements in #semicon equipment. The ink is dry on a brand-new five-year agreement. We couldn't be more proud to make this announcement on the eve of SEMI Japan, where groundbreaking advancements in semiconductor manufacturing take center stage. #TechnologyAdvancements #TNOSemicon Kazuya Aoki rob willekers Yoshihiko Sato Merijn Jacops Koji Yoshizawa Dirk van Baarle Kiyotada Nakamura
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"This week, Intel began to receive its first ASML's extreme ultraviolet (EUV) lithography tool with a 0.55 numerical aperture (High-NA), which it will use to learn how to use the technology before deploying the machines for a post-18A production node in the next couple of years or so. By contrast, TSMC is in no rush to adopt High-NA EUV any time soon, and it might be years before the company jumps on this bandwagon in 2030 or beyond, according to analysts from both China Renaissance & SemiAnalysis." #tsmc #intel #chips #foundries #innovation #semiconductors #semiconductorindustry #technology #technologynews
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ASML delivers cutting-edge new chipmaking tool — third-generation EUV enables 2nm processors and beyond 🤩🤯❤️ Chipmakers need speed; #ASML is here to deliver 🫶 This week, ASML delivered its 3rd Generation extreme ultraviolet (EUV) lithography tool, the Twinscan NXE:3800E, with a projection lens featuring a 0.33 numerical aperture. The system significantly increases performance compared to the existing Twinscan NXE:3600D machine. It is designed for fabricating chips at leading-edge technologies, including 3nm, 2nm, and small nodes in the next few years. The ASML Twinscan NXE:3800E represents a leap forward in Low-NA EUVlithography regarding performance (the number of wafers processed per hour) and matched machined overlay. The new system can process over 195 wafers per hour at a 30 mJ/cm^2 dose and promises a further increase in performance to 220 wph with a throughput upgrade. In addition, the new tool offers a less than 1.1 nm-matched machine overlay (wafer alignment accuracy). Thanks again to Anton Shilov and Tom's Hardware for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ejfupCd7 #semiconductorindustry #semiconductormanufacturing #technology #tech #chip #chips #thenetherlands #europe #foundry #idm #ai #aiot #ev #data #datecenters #smartphones #consumerelectronics #geopolitics #ic #wafer
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In the world of semiconductors, things move at a very slow pace, especially when it comes to the equipment that is required to manufacture the chips. ASML, a Dutch company is the dominant player in the EUV (Extreme Ultraviolet) lithography market and has been at the forefront of semiconductor manufacturing technology for years. Its machines are critical for producing advanced semiconductors at 7nm and below, and the company has invested heavily in perfecting this technology. But things seem to be changing. Professor Tsumoru Shintake from the Okinawa Institute of Science and Technology (OIST) has introduced a groundbreaking EUV lithography technology that is set to revolutionize #semiconductor manufacturing, especially for chips at 7nm and below. Link to the full substack article in comments #aichips #techinnovation #chiptechnology
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💡Intel Corporation presented publicly available detailed lay-out plans for 2 fabs (Fab 29.1 and Fab 29.2) at Magdeburg (Germany). 👉 Plans indicate an operational start date of Q4/27, although that could be delayed. 👉 Fabs equipped with high-NA EUV lithography equipment from ASML supporting process-technology 14A, 14A-E and later 10A. #semiconductor #technology
Blueprints for Intel Magdeburg fabs available for download
https://www.eenewseurope.com/en/
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ASML, has unveiled a new test laboratory in the Netherlands for its revolutionary High NA EUV lithography equipment. Teaming up with Imec, a Belgium chip research firm, this cutting-edge facility will provide early access to the innovative 350 million euro tool, a first of its kind in the industry. This new High NA tool boasts up to 60% better resolution, paving the way for the development of smaller and faster chips. ASML anticipates that customers will commence commercial production with this tool by 2025-2026. Notably, only a select group of chip manufacturers, including TSMC, Samsung, Intel, and memory specialists SK Hynix, can currently utilize ASML's existing EUV machines. With orders for over a dozen units in place, this technological advancement signifies a significant leap forward in chip manufacturing capabilities. ASML's collaboration with Imec underscores their commitment to driving innovation and setting new industry standards. #asml #techgiants #imec #chips #chipmanufacturing #highnaeuv #tsmc #samsung #intel #skhynix #foundries #semiconductors #semiconductor #semiconductormanufacturing #semiconductorindustry #innovation #technology #technologynews
ASML, Belgium's Imec open laboratory to test newest chip-making tool
reuters.com
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