Graphene Flagship’s Post

Overlay is becoming a significant problem in the manufacturing of semiconductors, especially in the world of advanced packaging substrates — think panels — the larger the area, the greater the potential for distortion due to warpage. Solving this issue requires more accurate models, better communication through feed forward/feed back throughout the flow, and real-time analytics that are baked into the process. Keith Best, director of product marketing for lithography at Onto Innovation, talks about the intricacies of overlay, the pros and cons of glass substrates, and what’s needed for high-volume manufacturing. https://lnkd.in/g3BhfyXw #semiconductor #advancedpackaging #warpage #glasssubstrates #overlay #RDL

At Sistem Technology, we are excited about the advanced capabilities and innovative design of our partner, C&D Semiconductor's wafer processing equipment, which aligns perfectly with the evolving needs of the semiconductor manufacturing industry, from R&D to high-volume production. Introducing the C&D Semiconductor P9500 Cluster System: A Breakthrough in Wafer Processing The P9500 Cluster System represents a significant advancement in semiconductor fabrication technology. This wafer processing system is meticulously designed to accommodate an extensive selection of modules, including various photoresist coaters, developers, vapour prime modules, hot plates, and chill plates, alongside specialised process modules that incorporate cutting-edge technologies like optical centering and edge bead removal. The C&D Semiconductor P9500 is designed to meet stringent process requirements with unparalleled customisation. This extensive suite of solutions includes a range of processes such as Photoresist Coating and Developing, Wafer Scrub and Clean, Megasonic Clean, Metal Lift-off, Spray Coating, Vapour Prime, Closed Lid Coating for Planarization, Optical Edge Bead Exposure, Wafer on Tape Frame, Wafer Alloy-Anneal, Wafer Inspection, Microscope Loader, and Photoresist Coating with minimal Electrostatic Discharge (ESD) for substrates ranging from 50mm to 300mm. Key Features: Precision Engineering: Ensures accurate processing of substrates, which is critical for high-quality semiconductor device fabrication. Modular Flexibility: Offers customisable configurations to meet specific research and production needs, enhancing process efficiency. Scalability: Expansion bays accommodate future growth, including larger substrate sizes and additional modules. Process Control: Specialised technologies optimise coating uniformity and minimize contamination, ensuring superior output quality. Compact Design: Maximises throughput while minimising footprint, ideal for space-constrained lab environments. The P9500's versatility as a coater, developer, vapour prime, bake, or chill unit—or any combination thereof—addresses a broad spectrum of photoresist spin coating and photosensitive polymer applications. This adaptability is essential for meeting the rigorous demands of modern semiconductor research and production. C&D's equipment can enhance efficiency, reduce costs, and push the boundaries of innovation in semiconductor manufacturing. For more detailed technical information, please visit our website or contact us directly. #SemiconductorResearch #WaferProcessing #PhotoresistTechnology #Nanofabrication #ScientificInnovation #SemiconductorEquipment #MaterialsScience #AdvancedManufacturing #R&D #HighVolumeManufacturing

My Thermo Fisher Scientific colleague Xiaoting Gu here shares key industry insights from #Semicon Korea, including the increasing need for 3D #semiconductor packaging and heterogeneous integration for higher bandwidth, reduced power consumption and overall system performance improvements. Read our team’s new blog post today, including related wafer level metrology and defect analysis solutions!

At 3D InCites, we’ve been talking about it for years: 3D heterogeneous integration is the path forward for advanced #semiconductor technology. Even proponents for the continuation of Moore’s law agree: 3D HI and chiplet technologies are the way to extend Moore’s law. They’ve even gone so far as to re-interpret Gordon Moore’s paper, citing a paragraph further down that suggests stacking is the way to continue scaling. Why then – as the latest blog post by Bob Patti, of member company NHanced Semiconductors, Inc. Semiconductors asks – are we still waiting for the full adoption of these manufacturing processes? The fact is that some significant technology and supply chain hurdles remain. But there is a solution – and it will heretofore be known as #Foundry 2.0: a new advanced packaging foundry model that promises to take 3D HI and chiplet technology to the mainstream. Read the full post – link in the comments.

Prevent Fab Failures Before They Start! Get the white paper detailing how to specify, design, and install next-generation linear motion systems in semiconductor equipment used in metrology, wire or die-bonding, wafer dicing, scribing, and packaging: http://ow.ly/cMTE50MelhK #linearmotion #fabrication #lineartechnology

We're absolutely thrilled to announce another cover and article feature with Chip Scale Review! This technical article follows our July 2023 viewpoint feature which introduced Multicolumn E-Beam Lithography technology as a leading enabler of advanced packaging applications. In this piece, we dive further into how Multibeam capabilities are ushering in a new generation of advanced packaging that enables adaptive patterning of denser interconnects between chiplets – delivering the high speed, low power chip to chip communication required to leapfrog to next-generation performance of integrated chips. The industry is starting to refer to this as #AdvancedIntegration.   Enjoy the read, and as we always say - Watch. This. Space! Whenever you’re ready to Accelerate Chip Innovation on your next brilliant idea, we’re ready to chat. 💬 #AdvancedPackaging #AdvancedIntegration #MulticolumnEBeamLithography #Multibeam https://lnkd.in/g9p75Kgk

The January 2024 PCB007 Magazine: Getting to Know Your Designer, featuring content from Summit Interconnect, Ventec International Group, IPC, Chemcut, NCAB Group and more, is out now. Download your copy today. In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?

Technology trends in dielectric materials for next generation 2.5D and 3D semiconductor packaging  http://mvnt.us/m2363020 @IDTechEx #Technology #3D #Packaging #Innovation #Manufacturing #Innovation 

If you're a PCB fabricator, you've probably asked yourself, "What do those PCB designers do all day, anyway? And why do they keep handing off incomplete data packages?" In this issue of PCB007 Magazine, we delve into what makes designers tick, and how to break down the barriers between fab and layout.

ADT International - Advanced Dicing Technologies Ltd. , particularly Wettable Quad Flat No-Lead (QFN) Dicing Saws, offers several features that enhance precision, efficiency, and reliability in semiconductor manufacturing. Here are some key features: Wettable Dicing Process: These saws utilize a wet dicing process, which involves the use of coolants or lubricants to reduce friction and heat during the cutting process. This helps prevent damage to delicate components and ensures high-precision cuts. High Precision Cutting: Advanced dicing saws are capable of achieving extremely precise cuts with minimal kerf loss. This precision is crucial for cutting intricate patterns and designs on semiconductor wafers. Multiple Dicing Modes: They typically offer various dicing modes such as standard dicing, stealth dicing, and through-silicon via (TSV) dicing, allowing manufacturers to choose the most suitable method for their specific application requirements. Automated Operation: Many advanced dicing saws feature automated operation capabilities, including automatic alignment, thickness measurement, and blade wear compensation. This automation reduces the need for manual intervention and improves overall productivity. Integrated Inspection Systems: Some models come equipped with integrated inspection systems that enable real-time monitoring of the dicing process. This ensures quality control by detecting defects or abnormalities during cutting. Versatile Substrate Compatibility: Wettable QFN dicing saws are designed to accommodate a wide range of substrate materials, including silicon, glass, ceramics, and various types of semiconductor materials. Enhanced Blade Technologies: These dicing saws often incorporate advanced blade technologies such as ultra-thin blades, resin-bonded blades, or electroplated diamond blades, which provide superior cutting performance and extended blade life. Customizable Parameters: Users can typically adjust various parameters such as feed rate, spindle speed, and cutting depth to optimize the dicing process for specific materials and applications. Cleanroom Compatibility: Advanced dicing saws are designed to meet cleanroom standards, ensuring that the cutting process does not introduce contaminants that could compromise the integrity of semiconductor devices. Scalability and Integration: Manufacturers often offer scalable solutions that can be seamlessly integrated into existing semiconductor fabrication processes, allowing for efficient production scale-up and workflow optimization. Overall, Wettable QFN dicing saws represent a critical component of advanced semiconductor manufacturing processes, enabling precise, reliable, and efficient dicing of semiconductor wafers and substrates. #WettableQFNdicing #QFN #Dicing