iNEMI

iNEMI / MAESTRO Presentation to San Diego Chapters of IMAPS and ACers — Urmi Ray (iNEMI) will be presenting to a joint chapter meeting of iMAPS and ACers on Friday, November 9, at San Diego State University. Urmi will summarize 5G/6G MAESTRO, a roadmap effort supported by the NIST Office of Advanced Manufacturing, to create in the U.S. a world-leading knowledge base, technical expertise and a staged approach to mmWave material selection, characterization, and test to support the development and manufacture of leading edge 5G and 6G products. This roadmap continues to serve as a foundation for many new activities being undertaken by the CHIPS and Science Act. Registration for this meeting is free. Get additional details. https://lnkd.in/gz6gU54a

iNEMI End-of-Project Webinar: Investigation of AI Enhancement to AOI for PCBAs — Join us November 12 or 13 for highlights of iNEMI’s evaluation and validation of AI-enhanced AOI systems. The integration of artificial intelligence (AI) has emerged as a promising solution to enhance the capabilities of automated optical inspection (AOI) systems. It can help address the challenges of high false call rates and defect escapes, especially in more complex electronic designs. Initial project work by iNEMI evaluated and recommended AI technologies for AOI, established common performance metrics, and prepared test vehicles. In the second phase of the project, which is the focus of this webinar, the project team conducted rigorous experimentation using the metrics and test vehicles established in Phase 1. This webinar will report results and lessons learned from this effort and will also discuss challenges and future work in adopting AI into AOI. https://lnkd.in/eRCSvHq5

iNEMI Packaging Tech Topic Webinar: Navigating Advanced IC Substrate Technology and Market Trends — Join us November 6 when we welcome guest speaker M. Bilal Hachemi, Ph.D., Technology and Market Analyst for the Yole Group. In this webinar Dr. Hachemi will explore the latest trends and roadmaps in advanced IC substrates, focusing on the roles of organic and glass core technologies in enhancing package-level integration for AI and HPC applications. He will talk about the industry's progress in adopting glass substrates and trends in areas such as interconnect scaling, thermal management, and substrate reliability. He will also map new investments and capacity expansions around the globe. Register for this webinar. https://lnkd.in/eUF3AWvJ

Mark Schaffer, INEMI Project Manager and Sustainable Electronics Lead, was one of three presenters at the third technical experts meeting of the IPEF Critical Minerals Dialogue on Recycling and Recovery in September. In this virtual meeting, Mark shared information about iNEMI’s efforts in sustainability and circularity. The Indo-Pacific Economic Framework for Prosperity (IPEF) is a partnership among 14 countries committed to fuel inclusive, sustainable growth to create a stronger, fairer, more resilient economy for families, workers, and businesses in the United States and in the Indo-Pacific region. Read more. https://lnkd.in/eFnsnRgC

iNEMI PCB Connector Footprint Tolerance End-of-Project Webinar — Join us Monday, October 28, for information about this project’s investigation of industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. The ongoing reduction in connector pitch imposes stringent design requirements on PCB fabrication processes. This iNEMI project aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. The team identified potential risks and surveyed the PCB industry to assess supplier capabilities for appropriate quality mitigation. This end-of-project webinar will review survey results and highlight areas of expectations and gaps between PCB fabricators and connector manufacturers. Additionally, the team will present recommendations for quality assessment and dimension control. Get additional details. https://lnkd.in/eHYXdhKx   

Paul Wang (MiTAC Computing Technology) will present “iNEMI Board Assembly-Press Fit Technology Roadmap of 2023 and 10 Years Beyond” at the SMTA International conference. His presentation is part of Session MFX2: Large Panel Assembly (Tuesday, October 22 / 10:30 a.m. - 12:00 p.m.) If you plan to be at SMTA International this year, be sure to check out this presentation, along with several others by iNEMI project teams. Hope to see you there! https://lnkd.in/eVTREidy

Mark Schaffer (iNEMI) will participate in the panel, Enabling Sustainability in the First Life of Electronics, at eSummit on Wednesday, October 23 (2:00-2:45 p.m.), in Austin, Texas. This panel will talk about practical challenges and how the industry is working to enable longer first use through extended warranties, support, software updates and increased durability. If you’d like information about iNEMI’s sustainability initiatives, or would like to meet during the conference, please contact Mark Schaffer ([email protected]). Get additional details about iNEMI activities at eSummit. https://lnkd.in/eKwKadin

Prabjit Singh (IBM) will present “Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth Bottom Terminated Components Solder Joints,” at this year’s SMTA International Conference. This presentation shares results from iNEMI’s Electromigration of SiBn Solder for Second-Level Interconnect Project. Several other roadmap and project team presentations are featured in the technical program, along with a Technology Town Hall co-hosted by iNEMI, HDP USER GROUP INTERNATIONAL INC and Surface Mount Technology Association (SMTA). Get a detailed schedule of iNEMI presentations at the conference. https://lnkd.in/eVTREidy

iNEMI Presentations at SMTA International — Richard Coyle (Nokia Bell Labs) is presenting papers on behalf of two iNEMI projects — Characterization of Third Generation High-Reliability Pb-Free Alloys and Bi-Sn Based Low-Temperature Soldering Process and Reliability — at SMTA International this year. Get details about iNEMI presentations included in the technical program plus the Technology Town Hall we are co-hosting with HDP USER GROUP INTERNATIONAL INC and Surface Mount Technology Association (SMTA). We hope to see you there! https://lnkd.in/eVTREidy

iNEMI Panel on Circularity at eSummit (October 22; Austin, Texas) — Mark Schaffer (iNEMI) will moderate an iNEMI panel at the Electronics Sustainability Summit (eSummit) entitled “There’s No End to a Circle: How to Address Circularity Challenges in Electronics Manufacturing.” The session is scheduled for 9:00-10:00 a.m. on Tuesday, October 22, and features panelists Kelly Scanlon, Lead Sustainability Strategist for IPC; Cassie Gruber, Director of Business Development for Jabil’s Scope 3 & Circular Solutions; and Rich Bulger, author of the book, Going Circular. If you plan to attend this year’s eSummit, please join us for an open discussion about key challenges to, and opportunities for, implementing circular economy, and share with us the problems and solutions you are experiencing. Get additional details. https://lnkd.in/eKwKadin