Thin Film characterization are important in the development phase of new materials to minimize the time to market of a new generation of devices and in the metrology step, which is required for improving the yield of a production line for minimizing wafer-to-wafer variation. HORIBA a leader in optical spectroscopy from deep UV to XRF offers a unique range of high-end tools for Materials and Thin Film Analysis which can used in R&D, In-Line or integrated in a process chamber.

Key Benefits:

• Single sensor or multiple sensor platform
• For 4”,6”, 8” and 12 “ wafer size
• Fast measurement
• Modular and easy customization for OEM integration
• Global Application support.