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Cmos-chip structure in 2000s (en).svg
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Cr, Cu and Au liners
poly-Si gate
STI
p-well
USG
tungsten
buried SiO2
p-silicon wafer
n-well
USG
SOD
SOD
Cu1
PSG
SiN barrier
layer
CoSi2
SiC seal layer
PE-TEOS
Cu 2
SiC etch stop layer
Ta/TaN barrier layer
SiN seal layer
seal layer (nitride or oxide)
PSG
Cu 5
SOD
SOD
n-Si
n-Si
p-Si
p-Si
Cu 4
Cu 4
Cu 4
Cu 5
SiC etch stop layer
spacer
Cu 3
Cu 2
Cu 2
Legend:
Silicon (Si)
Polysilicon (Poly-Si)
Undoped silicon glass (USG, SiO )
Silicon dioxide (TEOS oxide, SiO )
Cobalt disilicide (CoSi )
Spin-on dielectric (SOD)
Phosphor-silicate glass (PSG)
2
Tungsten (W)
Copper (Cu)
Silicon nitride (SiN)
Silicon nitride (SiN)
Silicon carbide (SiC)
n-Si
p-Si
2
2
lead-free
solder bump
back-end /
"Advanced Packaging"
BEOL
front-end
FEOL
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