Simcenter Flotherm

Simulate the complete range of heat transfer phenomena, from convection to radiation, storage to dissipation, and steady-state to dynamic and transient environmental influences. TAITherm thermal analysis software is as easy to use as it is powerful. It solves for solar and thermal radiation, convection, and conduction, including ever-changing environments. TAITherm removes the burden of complicated thermal simulations and ensures that your design will function optimally in real-world scenarios. TAITherm is used by thousands of engineers and teams around the globe. Our customers use TAITherm for an array of applications including the latest advancements in automotive, electronics, wearables, military technology, architecture, and more. Our customers are pushing the boundaries of new technology by increasing usability, safety, and effectiveness in their industries through thermal simulations and thermal analysis.

Ansys Sherlock is the only reliability physics-based electronics design tool that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early stage design. Ansys Sherlock automated design analysis provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. Sherlock bypasses the ‘test-fail-fix-repeat’ cycle by empowering designers to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs) and assemblies to predict failure risks due to thermal, mechanical and manufacturing stressors--all before prototype. With embedded libraries containing over 500,000 parts, Sherlock rapidly converts electronic computer-aided design (ECAD) files into computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each model contains accurate geometries, material properties and translates stress information.