Siddharth Seth

𝐖𝐡𝐲 𝐢𝐬 𝐦𝐚𝐧𝐚𝐠𝐢𝐧𝐠 𝐜𝐨𝐦𝐩𝐨𝐧𝐞𝐧𝐭𝐬 𝐢𝐧 𝐭𝐡𝐞 #SemicoductorIndustry 𝐥𝐢𝐤𝐞 𝐬𝐨𝐥𝐯𝐢𝐧𝐠 𝐚 𝐩𝐮𝐳𝐳𝐥𝐞? 𝐁𝐞𝐜𝐚𝐮𝐬𝐞 𝐰𝐞 𝐧𝐞𝐞𝐝 𝐚𝐥𝐥 𝐭𝐡𝐞 𝐩𝐢𝐞𝐜𝐞𝐬 𝐭𝐨 𝐟𝐢𝐭 𝐩𝐞𝐫𝐟𝐞𝐜𝐭𝐥𝐲! . . . Managing Last Time Buy (LTB) for components across multiple products can be a tricky balancing act. I follow different strategies for different products to avoid excess material and budget overruns. 𝐓𝐡𝐞 𝐒𝐨𝐥𝐮𝐭𝐢𝐨𝐧: ☑ 𝘗𝘳𝘪𝘮𝘦 𝘗𝘳𝘰𝘥𝘶𝘤𝘵𝘴: For products at their peak, I secure LTB inventory that supports the qualification period for replacements and sufficient time for customers to switch to new technology. ☑ 𝘕𝘦𝘢𝘳𝘪𝘯𝘨 𝘌𝘯𝘥-𝘰𝘧-𝘓𝘪𝘧𝘦 𝘗𝘳𝘰𝘥𝘶𝘤𝘵𝘴: For products nearing the end of their lifecycle, I plan LTB to cover their remaining operational period. This avoids unnecessary investment in phasing-out products. 𝐓𝐡𝐞 𝐈𝐦𝐩𝐚𝐜𝐭: ✅ 𝘊𝘶𝘴𝘵𝘰𝘮𝘦𝘳 𝘚𝘢𝘵𝘪𝘴𝘧𝘢𝘤𝘵𝘪𝘰𝘯: By ensuring continuity and smooth transitions, our customers stay happy. ✅ 𝘉𝘶𝘥𝘨𝘦𝘵 𝘖𝘱𝘵𝘪𝘮𝘪𝘻𝘢𝘵𝘪𝘰𝘯: Smart LTB strategies help us optimize our budget and resource allocation. ✅ 𝘚𝘦𝘢𝘮𝘭𝘦𝘴𝘴 𝘛𝘳𝘢𝘯𝘴𝘪𝘵𝘪𝘰𝘯: Efficiently managing component changes ensures smooth transitions from old to new technologies. 𝐄𝐟𝐟𝐞𝐜𝐭𝐢𝐯𝐞 𝐋𝐓𝐁 𝐬𝐭𝐫𝐚𝐭𝐞𝐠𝐢𝐞𝐬 𝐮𝐧𝐝𝐞𝐫𝐬𝐜𝐨𝐫𝐞 𝐭𝐡𝐞 𝐢𝐦𝐩𝐨𝐫𝐭𝐚𝐧𝐜𝐞 𝐨𝐟 𝐭𝐞𝐜𝐡𝐧𝐢𝐜𝐚𝐥 𝐞𝐱𝐩𝐞𝐫𝐭𝐢𝐬𝐞, 𝐥𝐞𝐚𝐝𝐞𝐫𝐬𝐡𝐢𝐩, 𝐜𝐫𝐨𝐬𝐬-𝐟𝐮𝐧𝐜𝐭𝐢𝐨𝐧𝐚𝐥 𝐜𝐨𝐥𝐥𝐚𝐛𝐨𝐫𝐚𝐭𝐢𝐨𝐧, 𝐚𝐧𝐝 𝐛𝐮𝐝𝐠𝐞𝐭 𝐦𝐚𝐧𝐚𝐠𝐞𝐦𝐞𝐧𝐭. Ready to solve the puzzle of component management? #ProductManagement #Innovation #CustomerEngagement #Leadership #BrightBytesWithRitam Picture Source: Bloomberg

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This article was written on 10th August, I am very glad it mentioned Jim Collins' book - How the Mighty Fall. I also described what could be of Intel at their 4th stage of decline with slim chance of recovery, while the 5th is terminal. • https://lnkd.in/gR98BrJX • https://lnkd.in/g6Vv_DxM • https://lnkd.in/gWAjbDie Disrupted by Technology is very real, and cannot be underestimated, Incumbents usually fall into complacency and it can happen to anyone, including countries; just look at the colonial rulers between 1500s and 1900s, where are they now? From my Research, Study and Teach on Technology Management Science and Innovation Strategy 💡 of Theory as Lenses to Seeing What's Next - Robotics AI Technology is Disruptive and Singapore needs to investigate, study how to deploy as Innovation for our competitiveness FutureReady. Do support my Leadership Initiative 🌸

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5 Ways Chip Packaging Will Define Next Generation of Chips Traditional chip design is reaching its physical limitations(moore's law). That's where advanced chip packaging comes in. Here's how it will impact the next generation of chips: 🚀 Miniaturization and Higher Density: Newer packaging techniques allow for cramming more transistors into a smaller space. This enables building smaller, more powerful devices. A packaging technique- called "Fan-Out Wafer-Level Packaging" being used to create a smartphone chip. This technique embeds multiple memory layers around the processor core, shrinking the overall chip size while significantly boosting its memory capacity. 🚀 Increased Functionality: Advanced packaging lets you integrate different chiplets from various sources into a single unit. Imagine combining a high-performance processor with a specialized memory chip in one package for enhanced functionality. Consider a smartwatch that incorporates a high-performance processor for running apps alongside a low-power Bluetooth chip for connectivity. Advanced packaging would allow these two separate chiplets (miniaturized chips) to be stacked and interconnected within a single package, creating a powerful yet energy-efficient smartwatch chip. 🚀 Improved Performance: By optimizing electrical connections and heat dissipation, advanced packaging helps chips perform faster and more efficiently. Take a high-end graphics card. Here, advanced packaging might involve using materials with superior thermal conductivity to efficiently dissipate heat away from the GPU. This allows the GPU to run cooler and potentially reach higher clock speeds for smoother visuals. 🚀 Cost-Effectiveness: Being able to test and assemble chiplets separately can streamline manufacturing and potentially reduce costs. Let's say a manufacturer is developing a new gaming console. Through advanced packaging, they could design the console's main chip by combining a pre-tested general-purpose processor chiplet with a custom-designed graphics chiplet. This modular approach allows for independent testing and optimization of each chiplet, potentially reducing overall development and manufacturing costs. 🚀 Collaborative Design: Chip packaging engineers are now essential collaborators. They consider electrical, thermal, and mechanical factors to ensure seamless integration of various components within a chip. Imagine a team of chip designers and packaging engineers working together on a new AI chip. The packaging engineers would advise on the placement and interconnection of various chiplets responsible for processing, memory, and communication within the chip. Their expertise in thermal management would also be crucial to ensure the chip doesn't overheat during high-intensity AI tasks. Tell us what do you think of chip packaging's future? A detailed post is in comments.

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FINAL CALL OPTICA ONLINE INDUSTRY MEETING- PHOTONICS IN CANCER DIAGNOSIS & TREATMENT. It's an incredibly busy week for Optica. In a few hours, Tuesday, June 25th, marks a very special online industry meeting. REGISTER FREE HERE: https://lnkd.in/dmmGFKKM. We want to discuss the role of photonics in helping a growing number of people survive and recover from cancer. As we live longer, the incidence of cancer is rising, particularly in developing countries. We all know someone who has been affected. However, early detection vastly improves the chances of long-term survival. Artificial intelligence has the potential to transform cancer screening. How? By improving accuracy, efficiency, and speed of diagnosis. It may also help to solve the growing shortage of qualified radiologists. Optica is responding to requests from several corporate members to exchange ideas, strategies, and technologies to accelerate the detection and treatment of cancers. I still find it strange that I can use my phone to order something to be delivered anywhere on the planet. But there are still no consumer, handheld medically-certified devices to scan for lung, breast or prostate cancer. Yet personalised healthcare is shifting from the clinic to the home. Our online meeting brings together some of the world’s leading companies in Early Diagnosis and Treatment.  We will hear from Anna Nikiel, who leads Teledyne Technologies Incorporated's healthcare revolution in breast cancer screening. Meanwhile, in Tampere, Finland, I recall my visit to Modulight Corporation, who have 14 years of experience in building complete medical laser systems for oncology professionals. Inside their state of the art dedicated labs they work with industry partners to use lasers to treat lung, prostate, brain and spinal cancers. In our meeting, we will hear from Henni Teittinen of Modulight Corporation to better understand the mixture of technologies used to find the cause and the cure. We also welcome meaningful contributions from Jonathan Liu, Alpenglow Biosciences, Håkan Karlsson, HÜBNER Photonics, and Michele Lacerenza of Milan-based PIONIRS with their non-invasive brain measurement technology. Plus, we will have input from Celia Millon, the founder of RayVen, Mary Johnson, CEO Wavelength Electronics, Inc., Nathan Stebbins, Tech5USA, Francesca Mastropietro, ALPhANOV, and Piao Daqing of Oklahoma State University. We start our live conversation this Tuesday, June 25th (at the usual time of 10 AM EDT, 3 PM in the UK and Ireland, and 4 PM in Central Europe. I hope you can join us! Please share posts with others who could benefit from the conversation. Stay safe. Stay healthy.

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