JIACO Instruments

JIACO Instruments

Halfgeleiders

Delft, South Holland 716 volgers

Artifact-free decapsulation with atmospheric plasma

Over ons

JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for advanced package types like 3D, SiP, WLCSP, BOAC; all without process induced damage for reliable failure analysis and quality control. Our application range includes: - HAST, HTS, TMCL stressed Cu, PdCu, Au, Ag wire packages - Silver wire packages (new) - Wafer Level Chip Scale Package (WLCSP) (new) - High Tg mold compound (new) - Film Over Wire (FOW) (new) - Chip on Board (new) - Electrical Overstress (EOS) failure sites - Surface contamination and corrosion - Wedge bonds exposure - 3D stacked-die IC package - Gallium Arsenide (GaAs) and Gallium Nitride (GaN) devices (new) - System in Package (SiP) (new) - Localized decapsulation (new) - Sensors with transparent mold compound (new) - Bond Over Active Circuit (BOAC) with exposed copper metallization (new) - Redistribution Layer (RDL) with PBO and copper metallization (new) Other applications under R&D

Website
http://www.jiaco-instruments.com
Branche
Halfgeleiders
Bedrijfsgrootte
2-10 medewerkers
Hoofdkantoor
Delft, South Holland
Type
Particuliere onderneming
Opgericht
2014
Specialismen
Plasma decapsulation systems, Advanced IC package decapsulation, Copper wire decapsulation, Thermally stressed package decapsulation, LED package decapsulation, 3D stacked die package decapsulation, Silver wire decapsulation, Copper wire decapsulation, SAW BAW filter decapsulation, SIP & module decapsulation, Ag, Cu, PdCu, Au wire decapsulation, O2 only plasma decapsulation, EOS exposure en Underfill , FOW, die attach etching

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