ITEC

📣 ADAT3 XF TwinRevolve is a real game changer in flip-chip die bonding. Like all ITEC’s ADAT3 XF (eXtended Flexibility) die bonders, it has automatic wafer change. There’s full die traceability, auto recipe download (MES interface) and SECS/GEM interface. All are modular and field upgradable, so you don’t have to buy a new machine to upgrade performance. That brings unrivalled #sustainability. And its 60,000 flip chips/hour is 5 times faster than previous machines 💡 Watch this video to learn more! 🔔 #itec #innovation

📣Flip chips have better reliability, better electrical and thermal performance, and lower power consumption than the wire bonders they replace. However, they’ve been slow and expensive. Now, fast and low cost assembly of flip-chip devices is a reality 💡 Our new Flagship die bonder picks and flips in a fast, smooth action to assemble 60,000 flip-chip dies/hour. Instead of the traditional forwards/backwards up/down linear motion, there are twin rotating heads (#TwinRevolve) so there’s lower inertia and less vibration. That allows the same accuracy (better than 5 μm @ 1σ) at much higher speeds, so #chipmakers can now upgrade their high-volume production to flip chips 🔔 Visit our website to learn more! #itec #innovation

We are #hiring for multiple exciting roles. Check out these most recent #vacancies and apply today! 📌 Senior Service Engineer in Kuala Lumpur: https://lnkd.in/ezAvuE-t 📌 Senior Software Engineer in Wuxi: https://lnkd.in/eFTyjkEE 📌 Sales Operation Manager in Penang: https://lnkd.in/erCaTsrz #jobalert #jobsearch #jobopening #automation #softwareengineer

📣Instead of the traditional forwards and backwards, up/down linear motion, our latest ADAT3 XF #TwinRevolve Flip-Chip die bonder has two rotating heads so there’s lower inertia and less vibration. That allows flip-chip assembly with an accuracy better than 5 μm @ 1σ at speeds up to 60,000 devices/hour, so device makers can now upgrade their high-volume wire-bonded products to flip chips 🔔 In the article the Product Manager Die Bond Boud van Blokland shares more insight into the technical side of things 💡 Ask us about the TwinRevolve – the gamechanger for flip-chip assembly. #itec #innovation

🔔 Like the whole ADAT3 XF family, our new #TwinRevolve flip-chip die bonder makes best use of your valuable resources. It works at 5 times the speed of other flip-chip bonders. So, you only need a fifth of the number of machines 💡 That cuts factory space, maintenance, operator hours and spare parts. It also reduces energy consumption, which in turn means a much smaller carbon footprint. 📣 With the output of 60.000 dies/hour, TwinRevolve can help achieving the industry’s lowest Total Cost of Ownership, and like the other ADAT3 XF (eXtended Flexibility) machines, it’s modular and field upgradable for extended machine lifetime and even more sustainable operation. Learn more at our website! #itec #innovation

What do the Dutch windmill and ADAT3 XF #TwinRevolve have in common? More than you might think! The windmill inspired the concept of vertical pick and horizontal placement, leading to a significant technological advancement in the standard XF #die bonder. The recent design of two mills in-line, combined with a handover, resulted in the XF TwinRevolve—a flip-chip die bonder that delivers an output 5 times greater than any competitor. This #innovation allows the replacement of 5 machines with just 1, significantly reducing factory space and operational costs. As a result, it offers the industry's lowest Total Cost of Ownership 💡 For more information visit the website - https://lnkd.in/eCNWG5Qn 💡

🔔Our ADAT3 XF #TwinRevolve flip-chip die bonder eliminates the only disadvantage of flip chips – slow, costly assembly. With a production #speed of 60,000 devices per hour, this machine completely changes the game 🚀 Device makers can now introduce a new generation of flip-chip circuits, which are simply a better design than wire bonded ones and bring several key benefits. For more information visit the website - https://lnkd.in/eCNWG5Qn 💡  #itec #innovation

🔔 Exciting days for the ITEC team in Kuala Lumpur, exhibiting at #SEMICON Southeast Asia. With the official introduction of the ADAT3 XF TwinRevolve running at a ground-breaking speed of 60,000 UPH, launched by the ambassador of the Embassy of the Kingdom of the Netherlands in Malaysia, Mr. Jacques (Jaap) Werner, we cannot be more thrilled to continue our journey of redefining #semiconductor manufacturing 💡 Visit us at booth 3125 🤝

📢 Introducing our revolutionary ADAT3 XF #TwinRevolve flip-chip die bonder. This is a real game changer 🚀 It attaches up to 60,000 flip #chips per hour – 5 times faster than other die bonders. So, rather than needing 5 machines you only need 1, which cuts factory space, running costs and gives by far the industry’s lowest TCoO (Total Cost of Ownership) 🔔 Interested? Learn more 💡 #itec #launch #innovation

📣 Are you visiting #SEMICON SEA next week in Kuala Lumpur? Do not miss Boud van Blokland`s presentation at TECHStage of the forum on May 29, 11:20 AM. He will speak about our ground-breaking die bonder and share some insights into the technology, followed by a live demonstration at our booth #3125 💡 More information? Connect to Boud to learn more 🤝 #innovation #launch #itec