CITC - Chip Integration Technology Center

Another milestone for our PhD candidate Henry Antony Martin - well done!

Very happy to have given the acting Commissioner of the King in Gelderland, Henri Lenferink, a brief overview of our activities. In just 30 minutes, we informed him about CITC's ambition, our four program lines and our upcoming move to larger offices and labs. Thank you for visiting! P.S. Can you spot one of our latest developments on the Commissioner's fingertip? More information about this development will follow after the summer holidays.

We are moving this summer! Because we are growing in people and equipment, we are moving to new labs and offices within the same building on the Noviotech Campus. Our address therefore remains the same. Although the signing in the entrance hall has already been adjusted, we will gradually put the new labs and offices into use. Installing all the equipment and unpacking all the boxes will take some time - we expect to be fully operational again in the second week of August.

Happy birthday to… us! Today, we celebrated our 5th anniversary. The team enjoyed a tiny celebration with a big cake. We took a moment to reflect on the CITC journey to date and to commemorate CITC’s founder and first general manager, Barry Peet. Although he is no longer with us, we realize that without him CITC would not be what it is today. Looking ahead to the near future, there are several exciting things to come, including new housing this summer and our first Innovation Day on September 25. We will inform you in due course, so please stay tuned! 

On June 21, CITC and partner Sempro Technologies BV paid a return visit to the Technnasium students of Mondial College in Nijmegen. In April, 90 Mondial students visited CITC, Sempro and ITEC to learn more about chip production, packaging and all research & development efforts involved. The purpose of their visit was to gather enough input to create a chip exhibit that could be used at the Nijmegen Technology Day. During the return visit, the exhibits were assessed by CITC and Sempro. The jury certainly got a run for their money. In three sessions of eight presentations each, they not only had to judge each exhibit but also declare a winning team. This was not an easy task as most students worked very hard, but each team had its own interpretation of the assignment. The eventual winners had one thing in common: they had not only created a well-thought-out technical exhibit but also one with great presentation value. The jury was pleased to see that there are many talented technical students and hoped to see them again in a few years as engineers or researchers. Full article on: https://lnkd.in/gW5sdS2u #accesstoeducation #engineersofthefuture

Thank you Noviotech Campus for organizing this great event! We loved teaming up with GATT Technologies and defending your colors. Hopefully until next year!

Thank you Holst Centre for having us at your Innovation Day. We were pleased to showcase examples of our work in packaging of power electronics, RF and mmWave and integrated photonics. See you next year! #powerpackaging #mmwavepackaging #photonicspackaging

When you visit #PCIM Europe this week, don't forget to drop by the CITC booth, no. 441 in hall 6. Our colleagues Edsger Smits and Ruben Pranger (in photo below) are ready to show you interesting samples in power electronics packaging. And they brought stroopwafels... need we say more? #powerpackaging #semiconductorpackaging

CITC's Noud Schoenmakers was one of the speakers yesterday at the SEM Annual Conference and Exposition on Experimental and Applied Mechanics in Vancouver, WA, U.S. He talked about his research work on the mixed-mode fracture behavior of silver sintered joints for power packaging. His presentation was well received - well done Noud! #accesstoinnovation #experimentalmechanics #appliedmechanics

A new home for one of our 3D-printed chip package mockups... it is now in the display cabinet of the multiscale lab of Eindhoven University of Technology. TUe is one of our academic partners with whom we work on bridging the gap between academics and industry. We are happy to demonstrate our collaboration in this way. #accesstoinnovation #collaboration #semiconductorpackaging