Chandra Sekhar Mallela

total power will need to include power of digital layers also but PHY power is impressive

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Daily News ①HBM demand surge leads to an 8% DRAM price hike amid supply shortage. Industry heavily investing in High Bandwidth Memory (HBM) DRAM, while commodity DRAM is expected to face supply shortages. Reports indicate Samsung and SK Hynix are operating their commodity DRAM chip production at 80% to 90% capacity, contrasting sharply with NAND flash's full-speed production. Since early 2024, commodity DRAM capacity has only increased by approximately 10%.  ②Malaysia is emerging as a semiconductor hub in Southeast Asia. Supply chain diversification is crucial for semiconductor firms. Malaysia saw substantial investments from China, the US, the Netherlands, Singapore, and Japan. Taiwanese companies invested $129 million in 2022, making Taiwan Malaysia's 12th largest investor, with $112 million in the electronics and electrical sectors—Malaysia's proximity to Taiwan benefits semiconductor supply chains. ③AMD plans to construct a supercomputer with 1.2 million GPUs, potentially costing hundreds of billions. AMD's plan to build a cluster of 1.2 million GPUs for a supercomputer could greatly boost technological innovation and capacity expansion in the semiconductor industry. This initiative may manufacturers to ramp up production, expand facilities, streamline supply chains, and increase R&D investments to meet the high demand for computing power. End-users might also increase procurement of high-performance GPUs for their robust AI training capabilities. ④TSMC plans to build its third 2-nanometer chip manufacturing plant in Kaohsiung City. TSMC is constructing its first 2-nanometer fab in Kaohsiung, and the second fab is also underway. The planned third fab, Kaohsiung P3, covers 17.22 hectares and was reclassified by the Kaohsiung Urban Planning Commission as a Type A industrial zone on the 24th. After environmental impact assessments and soil pollution remediation, TSMC can apply for construction permits to start building the third 2-nanometer fab.  #randa #semiconductors #electroniccomponents #ic #cpu #mcu #gpu #supplychains #materials #EV #servers #AI #HBM #DRAM #NAND #AMD #solutions #procurementstrategies #trends #chips #MOSFET

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Tech Thought #2 "The Crucial Role of TSVs in High Bandwidth Memory: Performance, Thermal, and Mechanical Insights" In High Bandwidth Memory (HBM3), analyzing Through-Silicon Vias (TSVs) involves several critical aspects. Electrical performance is a key area of focus, where TSV resistance, capacitance, and signal integrity are evaluated to ensure they meet performance requirements and prevent issues like noise and crosstalk. Thermal performance is also crucial; it's important to assess how well TSVs manage heat dissipation and handle thermal cycling to maintain reliability under varying temperatures. Mechanical reliability is examined through stress and strain analysis, as well as fatigue testing, to ensure TSVs can withstand mechanical forces and repeated thermal cycles without failing. The manufacturing process is another critical aspect. Ensuring the quality of TSV fabrication, including proper alignment, filling, and insulation, is essential, and defect monitoring is necessary to avoid performance issues. Design considerations involve optimizing TSV density and placement to balance performance, power consumption, and area, and incorporating redundancy techniques can enhance reliability. Testing and validation are fundamental to confirm that TSVs operate correctly and reliably over time. Lastly, compatibility and integration are examined to ensure TSVs work well with other components and interfaces within the HBM3 system and integrate effectively within the overall packaging. Addressing these aspects comprehensively ensures that TSVs in HBM3 systems perform optimally and maintain high reliability. #SpintronicsAI #HBM #TSV #Semiconductors #ReliabilityEngineering #FutureOfMemory #ChipDesign #ElectronicsEngineering  

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key Segments of Semiconductor Ecosystem 1. Semiconductor Design: Companies: Companies in this segment focus on designing semiconductor components. They create the blueprint for the functionality and architecture of the chips. Examples: Intel, AMD, NVIDIA, Qualcomm, and Broadcom. 2. Semiconductor Fabrication (Fabs): Companies: Semiconductor fabrication involves the actual manufacturing of chips in specialized facilities known as fabs. These fabs are operated by companies specializing in semiconductor manufacturing. Examples: TSMC, Samsung Foundry, GlobalFoundries. 3. Electronic Design Automation (EDA): Companies: EDA companies provide tools and software used in the design and verification of semiconductor components, helping designers create and optimize their designs. Examples: Cadence Design Systems, Synopsys 4. Semiconductor Equipment Manufacturers: Companies: These companies produce the machinery and equipment required for semiconductor manufacturing, including lithography machines, wafer fabrication equipment, and testing tools. Examples: ASML (lithography machines), Applied Materials, Lam Research, KLA Corporation. 5. Semiconductor Test and Packaging: Companies: After the chips are manufactured, they undergo testing and packaging processes. Companies in this segment focus on testing and packaging solutions. Examples: Advantest, Teradyne, Amkor Technology, ASE Group. 6. Semiconductor IP (Intellectual Property): Companies: IP companies provide pre-designed and tested functional blocks (IP cores) that can be integrated into custom semiconductor designs, saving time and resources. Examples: ARM, Rambus, Imagination Technologies. 7. Distributors and Manufacturers' Representatives: Companies: These entities play a role in the distribution and sales of semiconductor components. They may act as intermediaries between manufacturers and end-users. Examples: Avnet, Arrow Electronics, Future Electronics. 8. Original Equipment Manufacturers (OEMs): Companies: OEMs integrate semiconductor components into their final products, such as smartphones, computers, cars, and consumer electronics. Examples: Apple, Dell, Samsung, General Motors. 9. End Users: Entities: These are the consumers and businesses that utilize electronic devices powered by semiconductor components. Examples: Individuals using smartphones, businesses employing servers and networking equipment, automotive manufacturers incorporating chips into vehicles. Source:TechoVedas

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US-headquartered semiconductor design company Synopsys Inc will help Tata Electronics ramp up designing custom semiconductor products, help in factory automation, data analytics, computer-aided design & supply product design kits, & develop intellectual property for chip fabrication, chief executive Sassine Ghazi told The Economic Times in an exclusive interview. Ghazi was in Mumbai to meet Tata Electronics Pvt. Ltd. CEO Dr. Randhir Thakur & TATA SONS LIMITED Chairman N. Chandrasekaran, & in Bengaluru to meet Ola chief Bhavish Aggarwal. “They (Tatas) are bringing the technology from a partner. We’re going to be working with them to tune it, bring it to their expectation of yield, power & performance & to bring their customers in,” he said. Synopsys Inc’ collaboration with the Tatas will be like its partnerships with Rapidus, TSMC, Intel, Samsung & GlobalFoundries, he said. Synopsys will also provide IP & design tools to Ola’s artificial intelligence startup, Krutrim, to develop an AI chip & a digital twin of the Indian company’s electronics systems, Ghazi said. “We will be the on-ramp to help customers get to the fab because you can build the most beautiful, sophisticated manufacturing facility but if you don’t have enablement where you provide the IP, & how semiconductor companies design with certain rules, for the manufacturing capacity, you cannot use the manufacturing. We’re the leader in providing the IP & the enablement for the semiconductor to on-ramp to the fab,” he said. “We are an enabler & there is a technology transfer that is happening. To enable that technology to go through the manufacturing process, there are tools that are required to enable that to happen & that is exactly what we are doing,” Synopsys India head Rituparna Mandal said. “Anyone who is trying to design a chip will make the first call to us, especially for advanced chips or those required for data centres that he (Bhavish Aggarwal) is planning on building. He has already hired a leader & is expanding the team to architect & design a ‘future’ chip. We have engaged with them in a range of IP, tools, & expertise, to accelerate that effort,” Ghazi said. “We will leave it to our customer when they want to announce (a deal), but we have an active engagement with them,” Ghazi said, hinting at an upcoming announcement from Ola. Ghazi said technology, skilling & startups will be the three areas he expects opportunities for the company to participate in India. “There are several factors in the investment India is making which is very similar to other governments. One is from a technology resilience point of view, which we are in the middle of. Two, skills. We have a strong academic programme Synopsis Academic and Research Alliances, in collab with the Indian government & certain universities,” he said https://lnkd.in/gvTg7mJP Join VLSI Jobs : Whatsapp Channel : https://lnkd.in/dHsz2TZh Download VLSI FOR ALL Community App : https://lnkd.in/dB_QDcHT #vlsiforall

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10 basic semiconductor industry terms You should know about: 🚀 Semiconductor: Analogy: Imagine a dimmer switch for a light bulb. Unlike a regular switch that is either on or off, a dimmer can be set at various levels. A semiconductor is like the dimmer switch for electricity; it can conduct electricity at different levels, unlike a regular conductor (like copper wire) that always conducts. 🚀 Transistor: Analogy: Think of a transistor like a water faucet. Just as a faucet controls the flow of water, a transistor controls the flow of electric current. It can turn the flow on, off, or regulate it to different levels. 🚀 Microchip: Analogy: A microchip is like a miniaturized city. It has buildings (transistors), roads (connections), and people (electrons) moving around. Just like a city, it’s designed to perform complex tasks efficiently. 🚀 Integrated Circuit (IC): Analogy: Consider an integrated circuit like a complex recipe that combines many ingredients (transistors, resistors, capacitors) to create a delicious dish (a functioning electronic device). Everything is mixed together in just the right amounts to get the desired result. 🚀 Wafer: Analogy: A wafer is like a pizza base. Just as you can make multiple slices of pizza from one base, multiple microchips can be made from a single semiconductor wafer. 🚀 Silicon: Analogy: Silicon is like the flour in baking. Just as flour is the main ingredient in many baked goods, silicon is the primary material used to make most semiconductors. 🚀 Doping: Analogy: Doping is like adding spices to a dish. Just as spices can change the flavor of a dish, adding small amounts of other elements to silicon can change its electrical properties, making it more or less conductive. 🚀 Clean Room: Analogy: A clean room is like a surgery room in a hospital. It’s an extremely clean environment where semiconductors are made to ensure that no dust or other contaminants interfere with the manufacturing process. 🚀 Moore's Law: Analogy: Moore’s Law is like a trend in fashion. Just as fashion trends change every few years, Moore’s Law suggests that the number of transistors on a chip doubles approximately every two years, leading to more powerful and efficient electronics. 🚀 FAB (Fabrication Plant): Analogy: A FAB is like a bakery. Just as a bakery bakes cakes, a FAB manufactures semiconductor devices. It’s where raw materials are turned into finished products through various processes. A detailed post is in comments. For all semiconductor and AI related content, follow TechoVedas

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Raise efficiency and power density in AI & data server power supplies 600 V SJ MOSFET with fast body diode improves switching and thermal performance in DC-DC soft switching applications. Read more: https://lnkd.in/du46kAWG #STPOWER

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