QuantumDiamonds hat dies direkt geteilt
Let us share a little bit more about the world’s first commercial quantum sensing tool for the semiconductor industry. What is QD m.0? 💎 It is an innovative electrical failure analysis (EFA) tool designed to address the biggest challenges in testing advanced chips of our era. Why is QD m.0 needed? 💎 The new generation of microelectronics relies on heterogeneous integration and advanced packaging to sustain the demands of AI, high-performance computing, and IoT. They involve stacking different chips on top of and beside each other within the same package. Before this transition, chips were tested throughout manufacturing and after packaging. However, advanced chip designs introduce "blind spots" that prevent thorough testing until packaging, hindering effective yield management. What makes chips assessments even more challenging is that conventional testing methods often lack the precision needed for complex 2.5D and 3D chips. With such designs, faults can occur in layers that light cannot penetrate without complex and destructive processing. This process, which involves removing each layer sequentially, is time-consuming, requires specific expertise, and risks destroying critical evidence. Due to the 3D nature of these faults, testing should deliver both lateral and depth information. An ideal EFA tool would analyze chip stacks and provide precise 3D fault coordinates. QD m.0 offers such capabilities, either for testing over the package (completely non-destructive) or testing after de-capsulation (minimally invasive). How does it work? 💎 QD m.0 leverages diamond-based quantum sensing to perform highly precise magnetic field measurements on integrated circuits. It then uses this data to create an image of the electrical activity within the chip. Since magnetic fields penetrate CMOS materials unimpeded, the QD m.0 can access different layers activity. At the core of the technology lies quantum-grade synthetic diamonds with atomic defects within the lattice that enable quantum sensing at room temperature. What can it do for me as an EFA engineer? 💎 QD m.0 is designed with the needs of the failure analysis engineer in mind. It comes with an xyz stage, as well as a working space for micro and nano-probers to bias your samples. The system operates at room conditions, has robust instrumentation and does not require complicated vacuum or cryogenics. It also comes with an easy-to-use interface and intuitive analysis tools. Our system can be utilized both for coarse fault localization (over-the-package or de-capsulated), as well as, fine fault localization (de-layered) in 3D. Faults, such as shorts, will be displayed as “magnetic hotspots” or “anomalies” within the region, with xy and z information. Hence, QD m.0 greatly accelerates the testing process of advanced chips by precise localization before root-cause analysis (FIB, SEM, etc.). Interested in learning more? 💎 Contact us!