OE-A (Organic and Printed Electronics Association)

Thrilled to unveil a fresh addition to LOPEC: Design@LOPEC! Designers get ready to dive into the future of #printedelectronics. ✨ Design@LOPEC Workshop – Tuesday, February 25 🔹 Hands-on sessions to unlock new creative possibilities. ✨ Round Table – Wednesday, February 26 🔹 Explore how flexible electronics is shaping next-gen product design and beyond. Details: https://lnkd.in/eQS55rpC Can’t wait to see you there for insights, inspiration, and innovation!

*Invitation to Participate in the Round Robin Test on Side Leakage* The OE- A Working Group #Encapsulation hosts a web seminar on November 28, 15:00-16:00 CET. Join this web seminar to enhance the understanding of moisture challenges in OPE devices. This initiative aims to foster collaboration and knowledge sharing among the members regarding the challenges and solutions related to encapsulation. Objectives of this event: Identifying Challenges: Understanding how side ingress of moisture affects various OE devices. Quantifying Barriers: Determining the water vapor transmission rate (WVTR) barriers required for different OE products. Measuring Strategies: Exploring effective measuring strategies and concepts. Reducing Diffusion: Investigating materials and concepts that minimize lateral diffusion in bulk and at interfaces.   Check out your inbox for details! Registration deadline is Tuesday, November 26. Kudos to the spokespersons of the WG Encapsulation Andrea Glawe, KROENERT GmbH & Co KG and Manuel Gensler, Fraunhofer-Institut für Angewandte Polymerforschung IAP for moderating this event!

We are happy to extend a warm welcome to our newest members 🎉👋 Great to have you on board and we look forward to working with you:   Nexatech, DE, https://nexa-tech.de/ AilArian, UK, https://ailarian.co.uk/   Have a great week!

Very soon it is time for one of the most powerful tech events in the world. CES, here we come! Meet you at the OE-A (Organic and Printed Electronics Association) Pavilion: January 07-10 at Venetian Expo, Level 2, Hall A, Global Pavilions Area at Booth #50718. #CES2025 At the OE-A Pavilion these member companies showcase their products and technologies to an international crowd:   Interlink Electronics Coatema Coating Machinery GmbH Holst Centre VTT OE-A (Organic and Printed Electronics Association) INO SD Print Beneli AB Arkema Piezotech   Mark your calendar for the networking reception January 08! 📌 OE-A invites the OE-A Community to a drinks reception on January 08 in Las Vegas. Further details on location and time will follow.   More details: OE-A@CES 2025, Las Vegas – Organic and Printed Electronics Association

✨Throwback to a OE-A Meeting at tesa in Norderstedt/Hamburg✨ Looking back on the recent OE-A member meeting at tesa, we can’t help but feel proud and grateful for OE-A’s 20-year journey. It was more than just a get-together—it was a celebration of two decades of innovation, creativity, and partnership in printed electronics. A big thank you to all the members, speakers, and participants who made it a special event! Some stand out moments: ➡️ Inspiring presentations from both industry leaders and up-and-coming startups ➡️ Great discussions about the future of printed electronics and sustainable innovation ➡️ Eye-opening visits to ELANTAS EUROPE, KROENERT GmbH & Co KG, and tesa to see their cutting-edge R&D ➡️ Networking opportunities that are sure to lead to exciting future collaborations Here’s to celebrating our history and looking forward to another 20 years of pushing the boundaries and driving innovation! 🚀 Make sure to mark your calendar for the next OE-A Meeting in Munich, February 24. One day prior to LOPEC. 🚀   #PrintedElectronics #Innovation #Collaboration #Networking

We are happy to extend a warm welcome to our new members who have recently joined OE-A (Organic and Printed Electronics Association)🎉👋:   Graphenicalab S.L., ES Luxembourg Institute of Science and Technology (LIST), LU   Great to have you on board. We look forward to working with you and wish everyone a happy weekend!

November 14, 14:00-17:10 h, we invite you to join the OE-A Session "Flexible and Printed Electronics for Automotive Applications" at the Printed Electronics Forum, Smart Mobility Stage, Hall B6  We are looking deep into PE for automotive applications with Integrated automotive HMI surfaces with decoration, touch, light Wolfgang Clemens, PolyIC GmbH & Co. KG (DE) IMSE is Shaping the Future of Automotive Design, Performance and Sustainability Dominique Heilborn, TactoTek (FI) Printed piezoelectric sensing solutions for automotive applications Declan Flannery, Interlink Electronics. (US) Digital Processes for 3D Circuit Carriers Dr. Wolfgang Eberhardt, Hahn-Schickard (DE) Process and cost-efficient automotive monitoring solutions Phil-Dominik Reukauf, Lohmann GmbH & Co. KG (DE) Reliability Improvements for Automotive Applications using AI and Quality Management Wolfgang Mildner, Bayflex Solutions, LLC (US) Printed Electronics: How conductive inks enable new opportunities to future automotive efficiency Aad van der Spuij, Henkel (BE) Elevating Precision and Resolution in Automotive Printed Electronics with HPCaP Technology Sahar Al Kamand, Hummink (FR) Customized & Scalable Printed Electronics Solutions for Automotive Dr. Florian Ullrich, FLEXOO (DE)

OE-A and LOPEC are looking forward meeting you at electronicaFair in Munich 🎉 Make sure to attend our Session on "Flexible and Printed Electronics: Applications & Technologies" on November 13, 2024, from 14:00 - 17:10 h at the Printed Electronics Forum, PCB & EMS Marketplace, Hall A1   Listen to, learn from and discuss with Printed E-Paper Display: Innovation and Applications Revolutionizing Display Technology Carlos Pinheiro, Ynvisible Interactive Inc (CA) Printed electronics in customised production: a case study in elderly care    Dr. Philip Renners, Witte Technology (DE) Smart Hard Hat for Workers Safety Monitoring and Environmental Evaluation José Matos, CeNTI - Centre for Nanotechnology and Advanced Materials Thermal Laser Processes in Printed Electronics - sustainable and rapid post-processing for high volume production Alexander Görk, Hamamatsu Photonics Deutschland GmbH (DE) Advancing Printed Electronics from Concepts to Upscaled Manufacturing using a Pilot Factory Antti Kemppainen, VTT (FI) Sustainable hybrid printed electronics allowing resilient method David Nilsson, RISE Research Institutes of Sweden (SE) Copper inks: Lower cost and sustainable alternative for printing PCBs, antennas and PV cells Ofer Shochet, Copprint (IL) Cut n' paste atomics: a new paradigm in graphene integration into flexible electronics Abhay Shivayogimath, 2D (DK) Low-Cost Copper Ink Enabling Mass Volume Printed Electronics Manufacturing    Steve Paschky, SARALON GmbH (DE)

Dear #PE Community your input is wanted! 10 minutes of your time help to combat the lack of skilled workers at different educational levels in our industry. Please support and fill in the survey below. Deadline December 15. All details about the project: https://lnkd.in/dbD_Mssq

Live now OE-A Web Seminar on #Diversity - How to deal succesfully with intercultural differences in your work teams? - Which 6 culture dimensions have an impact on your team? - Do you feel threatened by ambiguous or unknown situations, and therefore try to avoid them? - What does it mean to have a high uncertainty avoidance?   Very interesting answers and insights gives Marc Jacobs Web seminar will be recorded and available at my.OE-A