#Events Due to shorter development times and higher demands on #electronic #components and #systems, the role of #reliability assessment is constantly gaining in importance. The Fraunhofer IZM department “Environmental and Reliability Engineering” is organizing a two-day seminar to provide participants with the relevant methods and tools along the product development process. 🔗Register now and join the seminar »Reliability of Electronic Systems from November 21-22 in Berlin: https://lnkd.in/eQT79nZr The programme has been carefully curated to cover the reliability of electronic systems in all development phases: ➡️Definitions and introduction to important terms ➡️Methods for system assessments ➡️Stress impacts and resulting failure mechanisms ➡️Empirical and analytical failure modelling ➡️Systematics of FE simulation ➡️Implementation of realistic stress tests ➡️Analyzing and interpreting of test results ➡️Handling of reliability characteristics/parameters ➡️Assuring reliability by condition monitoring ➡️Analytical measurement methods Olaf Wittler, Johannes Jaeschke, Saskia Huber, Hans Walter, Marius van Dijk, Elisabeth Kolbinger, Max M.
Fraunhofer IZM
Forschung
Packaging technology for electronic system integration
Info
Fraunhofer IZM specializes in industry-oriented applied research. With four technology clusters, Fraunhofer IZM covers the entire spectrum of technologies and services necessary for developing reliable electronics and integrating new technology into applications. Our customers are as varied as the applications for electronics. We take on development projects for the automotive industry, healthcare and industrial electronics and even textile companies. Similarly, Fraunhofer IZM’s customers are extremely diverse, ranging from international electronics corporations to smaller SMEs integrating electronics into their products for the first time. Our spectrum of services caters for all. The technologies and product solutions developed by Fraunhofer IZM are easily integrated into the industrial manufacturing environment. We provide all our customers with access to equipment compatible with real-life manufacturing conditions. If required, we can even implement the new technologies directly on-site. Solutions for the Products of Tomorrow: Fraunhofer IZM’s Key Topics Fraunhofer IZM is international. Our work advances electronic packaging development around the world. The institute’s researchers sit on national and international boards that develop the standards required for innovative integration technologies. We pursue knowledge transfer internationally in cooperation projects with companies and high-profile research institutes around the world. Fraunhofer IZM offers its staff a platform for qualifying professionally and personally for positions of responsibility within the institute, in the business sector and in other areas of science.
- Website
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https://www.izm.fraunhofer.de/
Externer Link zu Fraunhofer IZM
- Branche
- Forschung
- Größe
- 201–500 Beschäftigte
- Hauptsitz
- Berlin
- Art
- Nonprofit
- Gegründet
- 1993
- Spezialgebiete
- Energie, Photonik, Semiconductors & Sensors, Automobiltechnik / Verkehrstechnik, Medizintechnik und Industrieelektronik
Orte
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Primär
Gustav-Meyer-Allee 25
Berlin, 13355, DE
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Ringstraße 12
Moritzburg, Saxony 01468, DE
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Karl-Marx Straße 69
Cottbus, Brandenburg 03044, DE
Beschäftigte von Fraunhofer IZM
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Tapani Jokinen
Strategic- & Circular- Design Consultant I Entrepreneur I Designing a Sustainable Future
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Andreas Middendorf
Business Development bei Fraunhofer IZM Berlin
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Bernd Stube
Business Development ASTROSE® | Power Line Monitoring | IOT
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Joao Marques
Microsystem-Technology, MEMS, embedded chips in PCBs
Updates
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Fraunhofer IZM hat dies direkt geteilt
📣 Last chance to send in your abstracts for E-Textiles 2024! 📣 Abstract submissions for the E-Textiles 2024 conference are only open until the end of the month, so send in your abstract now to share your exciting e-textile manufacturing knowledge, reliability results, design approaches, technological innovations, sustainable solutions and application specific developments with international experts, scholars and industry specialists! Submissions already span the globe with abstracts from America, Asia, Africa and Europe! Be a part of the growing worldwide E-Textile community and submit your abstract until the 31st of July at https://lnkd.in/eJcmdxza! E-Textiles 2024 is organized by Fraunhofer IZM and University of Southampton and is sponsored by IEEE and the EPS - IEEE Electronics Packaging Society. All accepted authors (oral and poster presentations) may publish full conference papers on IEEE Xplore. 📅 Conference Details: 📍 Location: Fraunhofer-Forum Berlin, Germany 🗓️ Dates: November 19th - 21th, 2024 ℹ https://lnkd.in/eK3Ep4yg 🕒 Abstract Submission Deadline: July 31, 2024 🕒 Early Bird Deadline: July 31, 2024 ✨ Head over to https://lnkd.in/e64Mg_CN to have a look at our stellar lineup of keynote and invited speakers! Do you want to attend the conference but don't have results to present? Register now as a participant and profit from the early bird discount up until the end of July. See you in Berlin in November! #etextiles #textiles #Berlin
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Throwback from #RealIZM The telecommunications infrastructure is turning to photonics in order to guarantee the constantly growing data volumes and speeds in #data #centers. Photonic components operate with low latency times, high bandwidths and extreme integration density. For an insight into selected research projects and which challenges can be solved with the help of photonics, read our interview with Dr. Tolga Tekin, head of the Photonic & Plasmonic Systems Group at Fraunhofer IZM, on our science blog for microelectronics: https://ow.ly/5xsS50SaUhR #NewsfromRealIZM #FraunhoferIZMBerlin #photonics © Fraunhofer IZM | Volker Mai
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#Events Our radar workshop goes into the next round! Join us for a deep dive into this fascinating topic and gain the expertise to become a #radar expert yourself. Our three-day chargeable workshop is designed as a mixture of lecture, practice and challenges and we look forward to your participation. 🔔 October 15 - 17, 2024 🔔 Registration possible until 8.10. You can find more information and register here: https://ow.ly/8Vz050SC60N #radar #workshop #learning #TI-#Ecosytem Christian Tschoban, Raschid Younes, Lukas Becker, Seyyid Dilek Texas Instruments
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Fraunhofer IZM hat dies direkt geteilt
💻 Digitale Vernetzung revolutioniert Medizin und Gesundheitswirtschaft. 🚀 Mit der gebündelten Expertise der Fraunhofer FOKUS, Fraunhofer Heinrich Hertz Institute HHI, Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik IPK und Fraunhofer IZM treibt das Zentrum „Digitale Vernetzung“ Innovationen voran, die nicht nur die medizinische Diagnostik und Behandlung verbessern, sondern auch die Produktion von Medizinprodukten revolutionieren. 🏥 So sollen Forschungsergebnisse schnell in digitale Prozesse und konkrete Anwendungen überführt werden, die unser Gesundheitssystem stärken und die Patientenversorgung optimieren. 🖼 Im Portrait erklärt der Leiter der Geschäftsstelle Dr. Maik Hampicke: „Mit Technologien und praxisnahen Lösungen für die Digitalisierung und zunehmende Vernetzung unterstützen wir Unternehmen bei der digitalen Transformation.“ Lesen Sie hier das ausführliche Portrait: https://lnkd.in/d3De6miH #HealthCapitalBB #DigitalHealth #Innovation #MedTech #Fraunhofer
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#womeninscience 👩🔬 As an electrical engineering graduate, Sarah-Jane Baur combines two of her passions in her job as a research assistant for the Environmental & Reliability Engineering department at Fraunhofer IZM: electronics and sustainability. In the MULTIMOLD EU Project project, she is involved in all research processes from the very beginning for the first time. As part of the project team, she is supporting the development of new production methods and identifying potential critical points from a sustainability perspective at an early stage. Together with her research partners, she uses the iterative nature of the multi-year research project to minimise these critical points wherever possible. More information about the project: https://www.multimold.eu/ #sustainability #manufacturing #microelectronics
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#Figureofthemonth The Fraunhofer IZM-ASSID “All Silicon System Integration Dresden - ASSID” has a 300(200)-mm 3D wafer-level process line with modules for TSV formation, pre-assembly, wafer-level assembly and stacking. Our colleagues at the Dresden site focus on process development, material and system evaluation as well as R&D services and prototyping in the field of packaging technologies for 200 mm and 300 mm wafers. You can read the interview with Manuela Junghähnel, PhD, site manager of Fraunhofer IZM-ASSID, on our science blog for microelectronics: https://ow.ly/5u3350SaTvK #NewsfromRealIZM #FraunhoferIZMBerlin #wafer #systemintegration #packaging © https://ow.ly/bgZA50SaTvL | Fraunhofer IZM-ASSID
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#Events Thank you for inspiring conversations, great encounters and new impulses and of course many greetings from SEMICON West! Together with Fraunhofer IPMS, our Fraunhofer IZM-ASSID team is in #SanFrancisco and is one of seven exhibitors at the Silicon Saxony booth showcasing our 300 mm research and development. 📍 Meet us at booth 944 in the South Hall. Take the opportunity and come say hello and meet Kay Viehweger @Frank Windrich Martin Landgraf @Sascha Boenhardt
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#Career In order to develop reliable #electronics, it is important to know the properties of a material. This is why components are thoroughly tested. One method used for this is #nanoindentation. #µknowsbest asks Simon Kuttler, who carries out reliability simulations at #FraunhoferIZM, tells us what nanoindentation is and how it is used: https://lnkd.in/euhKbEH5 #ResearchForNewcomers #µknowsbest #reliability #simulation #nanoindentation #material
#μknowsbest | Measuring Materials through Nanoindentation
https://www.youtube.com/
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#NewsfromRealIZM In their mission to advance the evolution of mobile communications (6G), researchers are working on technologies that make it possible to use high-frequency bands such as the D-band (110 GHz to 170 GHz) for extremely fast data transmission. However, increasing free-space attenuation and signal-blocking structures make it difficult to tap into the sub-THz range. One possible solution concerns reconfigurable intelligent surfaces (RIS). Robert Stöcker, research associate at Fraunhofer IZM in the "RF & Smart Sensor Systems" department, and his team developed a static RIS prototype. With their feasibility study, they show that this RIS technology could be used for high-frequency applications and further advance the urgently needed measurement technology. Find out more about 6G and RIS on the RealIZM blog for microelectronics: https://ow.ly/wa9i50SqNEl #FraunhoferIZM #RIS #radartechnology © Fraunhofer IZM | Volker Mai