#Video 📹A variety of application processes are necessary for the production of #microelectronic #components. Not every component can be joined or connected in the same way without losing stability or functionality. Fraunhofer IZM, for example, uses the contactless "jetting" process to apply adhesives or solders. In this process, material is pressed or jetted out of a small nozzle in portions at high speed. Using a jet valve, conductor structures with a width of approx. 500 µm can be applied to plastic-coated metal substrates. #Galinstan is used for this - an alloy of gallium, indium and tin that is liquid at room temperature. Galinstan has a higher thermal conductivity than standard thermal conductive pastes and is a non-toxic alternative to mercury. The use of the material as an electrical conductor, e.g. on flex, TPU or textiles, has the advantage that these cannot break. Galinstan is liquid and very flexible. It is almost unrivaled for applications with dynamic mechanical stress, as it can be stretched 1 million times without failure. This makes the material interesting for soft robotics, wearables and smart textiles. The jet process and Galinstan were used in the SoMaRo ("SoftMaterialRobotics") project for stretchable conductor paths and #sensors on #robot grippers. More about the research of our research group: https://ow.ly/qUCH50Tv1wA #FraunhoferIZM #microelectronics #innovation © Mathias Koch | Fraunhofer IZM
Fraunhofer IZM
Forschung
Packaging technology for electronic system integration
Info
Fraunhofer IZM specializes in industry-oriented applied research. With four technology clusters, Fraunhofer IZM covers the entire spectrum of technologies and services necessary for developing reliable electronics and integrating new technology into applications. Our customers are as varied as the applications for electronics. We take on development projects for the automotive industry, healthcare and industrial electronics and even textile companies. Similarly, Fraunhofer IZM’s customers are extremely diverse, ranging from international electronics corporations to smaller SMEs integrating electronics into their products for the first time. Our spectrum of services caters for all. The technologies and product solutions developed by Fraunhofer IZM are easily integrated into the industrial manufacturing environment. We provide all our customers with access to equipment compatible with real-life manufacturing conditions. If required, we can even implement the new technologies directly on-site. Solutions for the Products of Tomorrow: Fraunhofer IZM’s Key Topics Fraunhofer IZM is international. Our work advances electronic packaging development around the world. The institute’s researchers sit on national and international boards that develop the standards required for innovative integration technologies. We pursue knowledge transfer internationally in cooperation projects with companies and high-profile research institutes around the world. Fraunhofer IZM offers its staff a platform for qualifying professionally and personally for positions of responsibility within the institute, in the business sector and in other areas of science.
- Website
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https://www.izm.fraunhofer.de/
Externer Link zu Fraunhofer IZM
- Branche
- Forschung
- Größe
- 201–500 Beschäftigte
- Hauptsitz
- Berlin
- Art
- Nonprofit
- Gegründet
- 1993
- Spezialgebiete
- Energie, Photonik, Semiconductors & Sensors, Automobiltechnik / Verkehrstechnik, Medizintechnik und Industrieelektronik
Orte
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Primär
Gustav-Meyer-Allee 25
Berlin, 13355, DE
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Ringstraße 12
Moritzburg, Saxony 01468, DE
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Karl-Marx Straße 69
Cottbus, Brandenburg 03044, DE
Beschäftigte von Fraunhofer IZM
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Tapani Jokinen
Strategic- & Circular- Design Consultant I Entrepreneur I Designing a Sustainable Future
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Andreas Middendorf
Business Development bei Fraunhofer IZM Berlin
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Bernd Stube
Business Development ASTROSE® | Power Line Monitoring | IOT
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Joao Marques
Microsystem-Technology, MEMS, embedded chips in PCBs
Updates
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#Events 👉 Get to know the #experts: Olaf Wittler and Johannes Jaeschke will talk about “Reliability Management Basics” at the #seminar “#Reliability of Electronic Systems”. 💡Learn more about reliability aspects of #ElectronicSystems in all #development & #production phases with 12 experts in 4 deep dive sessions. The agenda is rounded off with hands-on workshops and lab tours. The seminar will be take place from Nov 21 to Nov 22 2024 at Fraunhofer IZM in Berlin. 🔗Visit the website to view the full program, speaker list and #registration: https://lnkd.in/eQT79nZr #reliabilitymanagement #expertsession #microelectronics #FraunhoferIZM #registernow
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Mark your calendars for October 10, 2024! Join our Green ICT Online-Seminar on »From CMOS Fabrication to Advanced Packaging – Ecological Aspects« from 3:30 to 5:00 pm, CET. Learn from our experts Dr. Violeta Prodanović and Dr. Michael Schiffer about the environmental footprint of IC production and discover ways to enhance sustainability in #semiconductor processes. Don't miss this session! FMD - Forschungsfabrik Mikroelektronik Deutschland
#Events 💻Register now for our next #Green #ICT Online-#Seminar about »From CMOS Fabrication to Advanced Packaging – Ecological Aspects« for October 10, 2024, 3:30 to 5:00 pm, CET: https://lnkd.in/eGrHjjEf After general information on the #semiconductor production and the cleanroom operational aspects, our experts Dr. Violeta Prodanović and Dr. Michael Schiffer focus on the environmental footprint of the IC production, including front-end, Wafer-Level-System-Ingtegarion- and packaging processes. They`ll discuss consumption of resources (water, energy, chemicals) over various technology nodes and different measures to improve sustainability of these processes. The online seminar is aimed at: ➡️Companies along the front-end and back-end process chain ➡️Companies that want to plan, build and operate cleanrooms sustainably ➡️Consulting firms with a focus on "Environmentally friendly processing in electronic packaging" This Fraunhofer IZM online seminar is part of the qualification and further training program offered by the »Green ICT @ FMD« competence center for professionals and graduates from the information and communication technology sector. The Green ICT Competence Center at the Research Fab Microelectronics Germany (»Green ICT @ FMD«) is a central point of contact for sustainable electronics. The Federal Ministry of Education and Research supports the project as part of the Green ICT initiative, which is part of the German government's 2030 climate protection program. FMD - Forschungsfabrik Mikroelektronik Deutschland
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#Press ⚡To ensure the #reliability of microelectronic systems, lengthy and expensive experiments are often necessary. With the newly launched “mikroVAL” project, ten partners from research and industry under the project lead of Fraunhofer IZM want to make these qualification tests more flexible and less expensive: By using state-of-the-art modeling principles, they are to be simulated realistically and practically. 🔎The aim of the workflow is to #simulate the properties of #microelectronic #components, housings and solder connections while protecting the intellectual property of the manufacturers. The models created can be reused several times and integrated into increasingly complex systems. 👉In the long term, the use of simulations reduces the costs and effort involved in developing reliable microelectronics. This creates an incentive to develop more durable products, which in turn makes a fundamental contribution to conserving resources. 🔗The full text is available on our website: https://lnkd.in/euSsaMkT Hella GmbH, Robert Bosch GmbH, Siemens, BMW Group, budatec GmbH, Fraunhofer IKTS, Technische Universität Dresden, Technische Universität Berlin, Jade Hochschule Olaf Wittler, Marius van Dijk
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#Career PICs (photonic integrated circuits) don't hide their light under a bushel: they are used for data transfer, in optical sensors and, more recently, in quantum computers. #µknowsbest asks, how they work and what makes them special. 🔎 Want to find out more about microelectronics terms? Then click here and scroll through our µknowsbest archive: https://lnkd.in/emR4TCy #ResearchforNewcomers #µknowsbest #PIC #Photonik #Photonics
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#NewsfromRealIZM Focus on innovation! The Chiplet Center of Excellence (CCoE) in Dresden, a joint research initiative of Fraunhofer Izm-assid, Fraunhofer IIS, Institutsteil Entwicklung Adaptiver Systeme EAS and Fraunhofer ENAS, aims to improve automotive electronics. Dr. Michael Schiffer and Dr. Andreas Ostmann, heads of two departments at Fraunhofer IZM, spoke with RealIZM about the need to develop innovative chiplet solutions and drive heterogeneous integration and electronic packaging in Europe. Find out how the CCoE is setting new standards for the future of the automotive industry in our latest blog post. Read more! https://ow.ly/aCst50Tt0k3 #Chiplet #AutomotiveInnovation #HeterogeneousIntegration
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Bonjour from Paris! European Microwave Week is where academia meets industry - the largest trade show dedicated to #Microwaves and #RF in Europe cannot take place without us, of course. Today is our second day and we are excited to see what new people and ideas we will meet today. Come by - we are at booth 925B Jens Schneider Tekfouy Lim Stanislav Winkler
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#Events 📆 Join the Market Report Launch Event on #circular business models in the #electronics industry! On 01. October, Circularity hold a dedicated launch event in Berlin, where they present the key findings of the report and discuss their implications with stakeholders and also put them into the context of the UNDRESS Circularity project. Register here: https://lnkd.in/gdqzWeq5 ♻ The aim of the project UNDRESS Circularity is to investigate whether circular business models lead to a more sustainable use of devices (here using the example of smartphones, laptops, cameras, games consoles) not only in theory, but also in their actual application. To this end, our team around Marina Proske are working together with Circularity e.V. and SystemiX. The report presented on October 1 is a large market analysis with a survey on current user behavior. Based on the results of this survey and the company data, our researchers are developing a methodology and scenarios on how to assess the environmental impact of this circular use compared to current, average use. Their publication is planned for spring 2025. 📔The market report marks the first joint publication of UNDRESS Circularity, the strategic industry project in which they work on assessing the impact of circular business models together with Systemiq Ltd. and our experts of Fraunhofer IZM as well as 12 industry partners (Grover rebuy recommerce GmbH Everphone Foxway Group Vodafone Reverse Logistics Group Assurant Recommerce Group Deutsche Telekom Ingram Micro FixFirst - The OS for Circular Services & Products circulee), Deloitte and DBU Deutsche Bundesstiftung Umwelt.
🚀 On 01. October, we launch our market report on circular business models in the electronics industry! 📔 The report provides latest figures and insights on the adoption and handling of rental, second-hand and repair in the electronics industry in Germany for both end users (B2C) as well as business users (B2B) from our market research, which we conducted with Verian Group and Institut der deutschen Wirtschaft. 📅 On 01. October, we hold a dedicated launch event in Berlin, where we present the key findings of the report and discuss their implications with stakeholders and also put them into the context of our UNDRESS Circularity project. 💡 The market report marks the first joint publication of UNDRESS Circularity, our strategic industry project in which we work on assessing the impact of circular business models together with Systemiq Ltd. and Fraunhofer IZM as well as 12 industry partners (Grover rebuy recommerce GmbH Everphone Foxway Group Vodafone Reverse Logistics Group Assurant Recommerce Group Deutsche Telekom Ingram Micro FixFirst - The OS for Circular Services & Products circulee), Deloitte and DBU Deutsche Bundesstiftung Umwelt.
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#Events ♻️Sie wollen Elektronik zuverlässig und nachhaltig gestalten? Dann melden Sie sich jetzt kostenlos zum ersten Treffen des Arbeitskreises »EcoReliability - Zuverlässige und nachhaltige Elektronik« am 20. November an: https://lnkd.in/e9YBRYPw 🗣️Bei dem Event mit hybrider Teilnahmemöglichkeit erwarten Sie Fachvorträge aus Industrie und ein interdisziplinärer Austausch. 🧩Der Arbeitskreis ist ein Forum, um Herausforderungen und Lösungsansätze aus der industriellen Anwendung und Forschung mit Partner*innen aus der Industrie zu diskutieren. Der Arbeitskreis wird vom FED (Fachverband Elektronikdesign und -fertigung e. V.) unterstützt. Weitere Informationen: https://www.ak-ecorel.de/ Elisabeth Kolbinger, Hans Walter, Chris Eckstein, Mirco Eckardt, ZESTRON Europe, Mandy Krott, Robert Bosch GmbH #ecoreliability
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#Events #Recap From September 11th to 13th we joined the 10th IEEE Electronics System-Integration Technology Conference (IEEE #ESTC 2024) in Berlin. We are proud to have welcomed over 400 participants from 27 countries. In addition to great conversations with old and new friends, we had many highlights: 🏅 1 Panel Discussion 🏅 3 chairs in the Poster Session 🏅 4 Keynotes 🏅 4 poster presentations 🏅 8 chairs in the Session 🏅 13 presentations We are particularly pleased for Nyake Gahein-Sama, who received the #BestPoster Award for his work “Alignment Between Subsequent 3D Molding Layers for Optimized Performance of 3D Integrated Patch Antennas for Advanced Sensing Applications.” Congratulations also to Andrei Costina, who received the #StudentTravel Award for his presentation "Manufacturing and Characterization of Thin-Film Tantalum Pentoxide Integrated Capacitors." Thanks to our colleagues who supervised this year's ESTC and shaped it with their input: Andreas Ostmann, Karl Becker, Henning Schröder, Rolf Aschenbrenner, Erik Jung, Michael Schiffer, Prof. Dr. Ing. Martin Schneider-Ramelow, Olaf Wittler and many more! We look forward to the next #ESTC!