#Career In order to develop reliable #electronics, it is important to know the properties of a material. This is why components are thoroughly tested. One method used for this is #nanoindentation. #µknowsbest asks Simon Kuttler, who carries out reliability simulations at #FraunhoferIZM, tells us what nanoindentation is and how it is used: https://lnkd.in/euhKbEH5 #ResearchForNewcomers #µknowsbest #reliability #simulation #nanoindentation #material
Fraunhofer IZM
Forschung
Packaging technology for electronic system integration
Info
Fraunhofer IZM specializes in industry-oriented applied research. With four technology clusters, Fraunhofer IZM covers the entire spectrum of technologies and services necessary for developing reliable electronics and integrating new technology into applications. Our customers are as varied as the applications for electronics. We take on development projects for the automotive industry, healthcare and industrial electronics and even textile companies. Similarly, Fraunhofer IZM’s customers are extremely diverse, ranging from international electronics corporations to smaller SMEs integrating electronics into their products for the first time. Our spectrum of services caters for all. The technologies and product solutions developed by Fraunhofer IZM are easily integrated into the industrial manufacturing environment. We provide all our customers with access to equipment compatible with real-life manufacturing conditions. If required, we can even implement the new technologies directly on-site. Solutions for the Products of Tomorrow: Fraunhofer IZM’s Key Topics Fraunhofer IZM is international. Our work advances electronic packaging development around the world. The institute’s researchers sit on national and international boards that develop the standards required for innovative integration technologies. We pursue knowledge transfer internationally in cooperation projects with companies and high-profile research institutes around the world. Fraunhofer IZM offers its staff a platform for qualifying professionally and personally for positions of responsibility within the institute, in the business sector and in other areas of science.
- Website
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https://www.izm.fraunhofer.de/
Externer Link zu Fraunhofer IZM
- Branche
- Forschung
- Größe
- 201–500 Beschäftigte
- Hauptsitz
- Berlin
- Art
- Nonprofit
- Gegründet
- 1993
- Spezialgebiete
- Energie, Photonik, Semiconductors & Sensors, Automobiltechnik / Verkehrstechnik, Medizintechnik und Industrieelektronik
Orte
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Primär
Gustav-Meyer-Allee 25
Berlin, 13355, DE
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Ringstraße 12
Moritzburg, Saxony 01468, DE
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Karl-Marx Straße 69
Cottbus, Brandenburg 03044, DE
Beschäftigte von Fraunhofer IZM
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Tapani Jokinen
Strategic- & Circular- Design Consultant I Entrepreneur I Designing a Sustainable Future
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Andreas Middendorf
Business Development bei Fraunhofer IZM Berlin
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Bernd Stube
Business Development ASTROSE® | Power Line Monitoring | IOT
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Joao Marques
Microsystem-Technology, MEMS, embedded chips in PCBs
Updates
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#NewsfromRealIZM In their mission to advance the evolution of mobile communications (6G), researchers are working on technologies that make it possible to use high-frequency bands such as the D-band (110 GHz to 170 GHz) for extremely fast data transmission. However, increasing free-space attenuation and signal-blocking structures make it difficult to tap into the sub-THz range. One possible solution concerns reconfigurable intelligent surfaces (RIS). Robert Stöcker, research associate at Fraunhofer IZM in the "RF & Smart Sensor Systems" department, and his team developed a static RIS prototype. With their feasibility study, they show that this RIS technology could be used for high-frequency applications and further advance the urgently needed measurement technology. Find out more about 6G and RIS on the RealIZM blog for microelectronics: https://ow.ly/wa9i50SqNEl #FraunhoferIZM #RIS #radartechnology © Fraunhofer IZM | Volker Mai
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#Events SEMICON West brings together the diverse global electronics supply chain to address the biggest opportunities and changes in the semiconductor ecosystem. Fraunhofer IZM-ASSID and Fraunhofer IPMS will jointly showcase their innovations at this important exhibition. The trade fair takes place from July 9 to 11, 2024 in San Francisco. Fraunhofer IZM’s center “All Silicon System Integration Dresden – ASSID”, operates a leading-edge, industry compatible 200/300 mm 3D wafer-level process line in Moritzburg, Saxony, which is ISO 9001-15 certified. Together with Fraunhofer IPMS, Fraunhofer IZM-ASSID is one of the seven exhibitors at the Silicon Saxony booth at Semicon West in San Francisco. More information: https://lnkd.in/eVpiumdk Manuela Junghähnel, PhD
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#Events Studis aufgepasst: 🚀Bewerbt euch jetzt für das »𝐆𝐫𝐞𝐞𝐧 𝐈𝐂𝐓 𝐂𝐚𝐦𝐩« vom 2. bis 6. September 2024 in Berlin und ergattert noch die letzten, freien Plätze! 🟢🟢🟢 Ihr seid an 𝐍𝐚𝐜𝐡𝐡𝐚𝐥𝐭𝐢𝐠𝐤𝐞𝐢𝐭 und 𝐑𝐞𝐬𝐬𝐨𝐮𝐫𝐜𝐞𝐧𝐞𝐟𝐟𝐢𝐳𝐢𝐞𝐧𝐳 interessiert und studiert in einem technischen, naturwissenschaftlichen oder interdisziplinären Bereich im mindestens 4. Fachsemester? Dann laden wir euch ein, am Green ICT Camp teilzunehmen, organisiert vom Kompetenzzentrum »𝐆𝐫𝐞𝐞𝐧 𝐈𝐂𝐓 @ 𝐅𝐌𝐃«. Unterstützt und ausgerichtet wir das Camp durch die FMD-Institute: Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, Fraunhofer IZM und Fraunhofer Heinrich Hertz Institute HHI. 🌐🌱 𝐖𝐚𝐬 𝐞𝐫𝐰𝐚𝐫𝐭𝐞𝐭 𝐝𝐢𝐜𝐡? ✅ Diskussionsrunden, Workshops und Gruppenarbeiten ✅ Gespräche mit erfahrenen Wissenschaftler:innen/Expert:innen aus dem Bereich ressourcenschonender IKT ✅ Soft Skills Training ✅ Side-Events, inkl. Galaabend ✅ Firmenexkursionen 📅 Datum: 2. bis 6. September 2024 ⏰ Montag - Freitag, ganztägiges Programm 📍 Ort: Berlin 💰 Das Camp ist kostenfrei, inkl. Unterkunft, Verpflegung 🗣️Sprache: Deutsch 📅 Der 𝐁𝐞𝐰𝐞𝐫𝐛𝐮𝐧𝐠𝐬𝐬𝐜𝐡𝐥𝐮𝐬𝐬 wurde auf den 14.7. verlängert! Seid dabei und 𝐠𝐞𝐬𝐭𝐚𝐥𝐭𝐞𝐭 𝐞𝐢𝐧𝐞 𝐧𝐚𝐜𝐡𝐡𝐚𝐥𝐭𝐢𝐠𝐞𝐫𝐞 𝐙𝐮𝐤𝐮𝐧𝐟𝐭 mit! Jetzt bewerben und eure Karriere in grüner Elektronik vorantreiben! 💚 👉Alle 𝐈𝐧𝐟𝐨𝐬 rund ums Camp und das 𝐁𝐞𝐰𝐞𝐫𝐛𝐮𝐧𝐠𝐬𝐟𝐨𝐫𝐦𝐮𝐥𝐚𝐫 findet ihr hier: https://greenict.de/camp/ FMD - Forschungsfabrik Mikroelektronik Deutschland
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#Events 🗣Meet our #6G experts Thi Huyen Le, Robert Stöcker and Jens Schneider of our group Communication Module Development at the Berlin 6G Conference at Berlin Congress Center (bcc) from tomorrow till July 4th. Meet our experts at the 6G-RIC Research and Innovation Cluster- Booth with No. #37. More information about the conference, Organized by the 6G Platform Germany, here: https://lnkd.in/eAkGNPuQ Our scientist Robert Stöcker will present two talks in the Technical Sessions: 👉July 3th from 2:00-3:30 pm about „Advanced RF Packages, Integrated Antennas and Reflectarrays for 6G and Sub-THz Radar Sensing Applications“ (special feature: One of managers of the department RF & Smart Sensor Systems, Prof. Dr. Ivan Ndip, will be one Chair of this Session about "Technologies and Circuits for Sub-THz Communication and Sensing" 👉July 4th from 09:15-10:20 am in the Technical Session "Reconfigurable Intelligent Surfaces: Theory, Optimization, and Experiments" Robert will present his second talk: „On the realization of RIS – about trade-offs, drawbacks and impairments“ You can find out more about the research group here: https://lnkd.in/e3N-PZeU #conference #materials #radar #antennas #6g #lzdv
We are thrilled & in the starting blocks to meet the #6G #pioneers at the upcoming #Berlin6G Conference (2-4 July). 𝗬𝗼𝘂 𝗰𝗮𝗻 𝗳𝗶𝗻𝗱 𝗮𝗻 𝗼𝘃𝗲𝗿𝘃𝗶𝗲𝘄 𝗼𝗳 𝗮𝗹𝗹 𝗼𝘂𝗿 𝗱𝗲𝗺𝗼𝘀, 𝘀𝗲𝘀𝘀𝗶𝗼𝗻𝘀 𝗮𝗻𝗱 𝘁𝗮𝗹𝗸𝘀 𝗵𝗲𝗿𝗲: https://lnkd.in/eE4XCUw2 Find all information about our #research on the #new 6G-RIC Website.→ https://6g-ric.de/ Meet our #experts at our 6G-RIC Booth No. #37 Thanks to our #6GRIC #partners and #Colleagues from 20 research institutions and universities within Germany to lay the scientific and technical foundations for 6G: Technische Universität Berlin, Technische Universität Braunschweig, Technische Universität Chemnitz, Christian-Albrechts-Universität zu Kiel, Universität Passau, Eberhard Karls Universität Tübingen, Fraunhofer Heinrich Hertz Institute HHI, RWTH Aachen University, Freie Universität Berlin, Humboldt-Universität zu Berlin, FAU Erlangen-Nürnberg, Max Planck Institute, Fraunhofer FOKUS, Fraunhofer IAF, Fraunhofer IIS, Fraunhofer IZM, Deutsches Zentrum für Luft-und Raumfahrt e.V., Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, Leibniz-Institut für Photonische Technologien and Universität Regensburg. See you tomorrow 👋! #6Gplatform #Berlin6G #Research
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Happy #SocialMediaDay! 🎉 Today, let's celebrate the power of connection, creativity, and community that social media brings into our lives. Take a moment to express gratitude for the friendships made, knowledge gained, and memories shared. Here's to spreading positivity and joy online! You can follow us on LinkedIn, Facebook, X, Instagram and YouTube where you can learn more about the exciting world of mircoelectronics research! #Social #Media #Day #FraunhoferIZM
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#Career 📝📣Do you like to write, and are you interested in technology topics? Then join our team as a student writer in Berlin! Find out everything you need to know here: https://ow.ly/1CKC50SmwXy #studentjob #workwithus
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#Stadtradeln #Team ☔☀Whether it was raining or hot, our colleagues cycled a lot: In total, we cycled over 15,000 km with almost 70 employees. That puts us in 67th place in Berlin, but we are incredibly proud of ourselves! 🚲🏆Our institute director also cycled diligently and came 5th in the overall ranking of the Fraunhofer IZM. Unbelievable are kilometres covered by our first-placed rider, however, as he covered 2,022.1 kilometres on the bike in just three weeks. That is unrivalled, but also the performance of all the others! It was fun for us and we say: Thank you #Stadtradeln! We look forward to taking part again in 2025.
Das war STADTRADELN 2024!
https://www.youtube.com/
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#Press 🦾Hand prostheses that restore dexterity to amputees. Sensors that recognise diseases before they break out. Thanks to microchips implanted in the body, such applications could soon become conventional therapy methods. At Fraunhofer IZM, the Technologies for Bioelectronics working group is working on biocompatible housings for miniaturised bio-electronics, which should be able to work in the body for decades in the future without additional interventions. 🦿In their current project NerveRepack, for example, they are developing intelligent prostheses that have neuronal interfaces. The so-called exoskeletons will be able to read motor commands from spinal nerves and integrate feedback from sensors on the feet to improve gait and enable smooth walking movements. In the long term, this should improve the quality of life for millions of people with amputated or paralysed limbs and enable greater social and financial independence. You can find out more about the project and the group in our latest press release: https://lnkd.in/eYEAKgza #bioelectronics #weknowhow #nerves
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#Throwback from #RealIZM There are more and more demands on what system components have to withstand when it comes to electronics. Operating temperatures, thermal conductivity, or the durability are just some of the main challenges. One crucial factor that deals with all three are metallic interconnections. Olaf Rämer, Fraunhofer IZM expert from the Metallic Interconnection Technologies (MIT) group, does research deep into the effects at the interconnection layers, mainly soldering, sintering, and the wire bonding processes. Metallic interconnections are chosen for their high thermal conductivity, heat resistance, reliability, electrical conductivity and strength, which makes them the optimal choice for many applications. The most prominent technology is silver sintering, as it can withstand high temperatures and shows good results in stress test and life cycle assessments. Learn more about this crucial technologies for power electronics on the RealIZM Blog: https://ow.ly/PnCO50SaMJ1 #NewsfromRealIZM #FraunhoferIZMBerlin #metallicinterconnections #powerelectronics © Fraunhofer IZM