Fraunhofer ENAS

🎓 Fantastic achievement: Recently, our colleague Robert Thalheim from our department “Printed Functionalities” completed and successfully defended his doctoral thesis at Technische Universität Chemnitz.   In his dissertation entitled “𝗘𝗹𝗲𝗰𝘁𝗿𝗶𝗰𝗮𝗹𝗹𝘆 𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗶𝘃𝗲 𝗳𝘂𝗻𝗰𝘁𝗶𝗼𝗻𝗮𝗹𝗶𝘇𝗮𝘁𝗶𝗼𝗻 𝗼𝗳 𝟯𝗗 𝗼𝗯𝗷𝗲𝗰𝘁𝘀 𝘂𝘀𝗶𝗻𝗴 𝗿𝗼𝗯𝗼𝘁-𝗴𝘂𝗶𝗱𝗲𝗱 𝗶𝗻𝗸𝗷𝗲𝘁 𝗽𝗿𝗶𝗻𝘁𝗶𝗻𝗴 𝗮𝗻𝗱 𝗱𝗶𝘀𝗽𝗲𝗻𝘀𝗶𝗻𝗴 𝗽𝗿𝗼𝗰𝗲𝘀𝘀𝗲𝘀,” he developed a printing process that allows to add electrical functions to 3D objects.   “Using robot-guided inkjet printing, we can print functional elements, such as conductive paths or antennas, directly onto a wide variety of 3D objects and complex large area surfaces,” explains the scientist. The secret lies in the robotic printing process and the special ink, which is applied onto the objects drop by drop, without contact and with high positioning accuracy. The ink is enriched with metallic nanoparticles that gives the printed layers electrically conductive properties, making it possible to individually create conductor tracks or even complex sensor systems. The process can be used to create customized antennas, printed sensor systems and contacts for microchips, large heating structures on seats or wire harnesses for car doors. This makes the process highly interesting for applications in the automotive, aviation and electronics industries.   His colleagues at the institute joined him in celebrating the completion of his doctoral thesis and honored his achievement with a creative and individual doctoral hat. Congratulations!   If you would like to find out more about the research and development services in the field of printed functionalities at Fraunhofer ENAS, you can find more information on our website: https://lnkd.in/eqVPP84m   #Phd #InkjetPrinting #FrauhoferENAS

Today we had the honor of welcoming our board of trustees members at Fraunhofer ENAS to our annual board of trustees meeting and taking them on a journey into the exciting world of our current research.   As advisors, the board of trustees supports us in questions of strategic orientation and development with valuable suggestions and impulses. Members are representatives from science, industry, business and public life.   Exciting contributions from our colleagues provided our members with valuable insights into our work, current research topics and projects that we are driving forward with creativity, passion and thanks to the ideas of many bright minds. This combination enables us to meet the challenges of the future, successfully shape the microelectronics landscape and drive progress.   We thank all members of our board of trustees for their contributions and the constructive and inspiring exchange!   #FraunhoferENAS #BoardOfTrustees

Over 70 percent of our “blue planet” is covered by our seas and oceans which hold many fascinating secrets.   To uncover these secrets – whether in marine biology to better understand the depths of our oceans and their inhabitants, in underwater topography to measure seabeds, for underwater navigation to guide divers, for inspection purposes to monitor critical underwater infrastructure or for underwater archaeology to unveil hidden mysteries – technologies from Fraunhofer ENAS play a decisive role.   With our micromachined ultrasonic transducers, it is possible to provide fascinating insights into such hidden worlds beneath the water surface based on ultrasound and to support locating, navigating or mapping. Therefore, it's no surprise that we will be presenting our expertise in this field from September 22 to 26, 2024 at the @2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS 2024) in Taipei, Taiwan.   Under the title "Underwater Sensing Applications Using Capacitive Micromachined Ultrasonic Transducers (CMUT)", our colleague Meghana Vishwanatha will provide insights into our ultrasound technologies for tasks waiting deep under water.   What's more: Since the performance of our silicon based micromachined ultrasonic transducers is not affected by the ambient temperature, they are also ideal for monitoring high-temperature processes. Under the title "High Temperature Liquid Level Monitoring Using Capacitive Micromachined Ultrasound Transducer", we will also be presenting our research activities in the field of measurement in high temperature processes.   Various industries such as chemical, pharmaceutical, food and beverage require measurements of different parameters at elevated temperatures. The high temperature conditions (e.g. 200 °C), can pose significant challenges for sensor performance and installation. One of the standout benefits of our silicon based CMUTs is their exceptional high temperature stability and no self-heating. This makes them particularly well-suited for applications where accurate monitoring is required at elevated temperatures.   In our latest study, we showcase the remarkable performance of our CMUTs for non-contact liquid level monitoring at temperatures reaching 200 °C. We are excited to present our findings this week at UFFC-JS 2024 in Taipei, too.   Stay tuned for a deep dive into how CMUT technology advances measurement in challenging environments. Will you also be at UFFC-JS 2024 as well? Meet our colleague Meghana Vishwanatha and exchange ideas directly with her.   Want to delve deeper into this topic? You can also find more information on our website: https://lnkd.in/eNJJHavu   #UFFCJS2024 #UFFC #Ultrasonic

Quantum technologies are opening a new era in science and technology and are the key to groundbreaking innovations in the field of sensor and computer technology as well as communication. Do you want to be part of this development? Then join Fraunhofer ENAS now and check out our current job opening for a 𝗥𝗲𝘀𝗲𝗮𝗿𝗰𝗵 𝗔𝘀𝘀𝗼𝗰𝗶𝗮𝘁𝗲 𝗶𝗻 𝗤𝘂𝗮𝗻𝘁𝘂𝗺 𝗧𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝗶𝗲𝘀!   Find out more about the job details here:   𝗥𝗲𝘀𝗲𝗮𝗿𝗰𝗵 𝗔𝘀𝘀𝗼𝗰𝗶𝗮𝘁𝗲 𝗤𝘂𝗮𝗻𝘁𝘂𝗺 𝗧𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝗶𝗲𝘀 https://lnkd.in/eUSkQUJU (German job posting)   We look forward to exploring the world of quantum technologies with you and breaking new ground in innovation!   #FraunhoferENAS #Hiring #Fraunhofer #Semiconductor #Techjob #Careers #JoinOurTeam #ApplyToday #Quantum #QuantumTechnologies ©Marc Andreu/Adobe Stock

Currently, we have the pleasure of participating in the annual 𝗕𝗠𝗧 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 hosted by the German Society for Biomedical Engineering (VDE DGBMT), which is one of the largest conferences and platforms for interdisciplinary exchange in the field of new biomedical trends. This year, it focuses on pivotal topics such as digital transformation, technical independence and patient-centered medicine. Our colleagues Dr. Mario Baum and Sven Lobner from our Department “Health Systems” present a first demonstrator, showcasing our latest research on a wearable device to support the diagnosis of mental disorders.   In close consultation with psychologists from Chemnitz, it combines a number of physiological indicators, such as heart rate, skin conductance and respiratory rhythm that are of interest in the context of mental health issues. A relation between psychological anomalies and physiological indicators has long been known and documented in related research. However, to date, these links have not been represented in current diagnostic approaches, which focus on anamnesis and questionnaires instead. In this way, the decision findings of psychologists could be better supported and their diagnoses objectified.   Integrating sensors into a smart patch, a wearable device is envisioned in the future, with its analyzed data can be displayed through a digital application for real-time or later consultation.   It is our expertise in printed, flexible electronics, sensors and in-house solutions to process data that drive this project further and enables us to walk new paths with wearable solutions for supporting psychological diagnoses.   You would like to find out more about our solutions to medical challenges? Find out more about our approaches to medical systems and smart health here: https://lnkd.in/dKVVzW2K.   #FraunhoferENAS #Fraunhofer #Healthinnovation #Microelectronics #Research #Flexibleelectronics #Mentalhealth #Smarthealth #Patientcenteredcare #Wearabletech #Sensors

Last chance to register: From 𝗦𝗲𝗽𝘁𝗲𝗺𝗯𝗲𝗿 𝟯𝟬 𝘁𝗼 𝗢𝗰𝘁𝗼𝗯𝗲𝗿 𝟭, 𝟮𝟬𝟮𝟰, the 𝗰𝗼𝗹𝗹𝗼𝗾𝘂𝗶𝘂𝗺 “𝗗𝗶𝗴𝗶𝘁𝗮𝗹 𝗜𝗺𝗮𝗴𝗲 𝗮𝗻𝗱 𝗩𝗼𝗹𝘂𝗺𝗲 𝗖𝗼𝗿𝗿𝗲𝗹𝗮𝘁𝗶𝗼𝗻” will take place in Chemnitz.   Organized by Chemnitzer Werkstoffmechanik GmbH, with which we have a long-standing cooperation, the two-day event provides an overview of how image and volume correlation can be used in the field of material and component testing, in damage or deformation analysis and in the reliability analysis of electronic components and systems.   Curious? Then take the opportunity today and visit the Chemnitzer Werkstoffmechanik GmbH website to find out more about the program and registration details: https://lnkd.in/eBtEvQ_A   Our Fraunhofer ENAS colleagues will also be waiting for you at our institute on day 2 with inspiring presentations and are looking forward to networking and exchanging new ideas.   #Event #SaveTheDate #Chemnitz

Great news: The Free State of Saxony is using European Union funds to support the establishment of a 𝗻𝗲𝘄 𝗰𝗼𝗺𝗽𝗲𝘁𝗲𝗻𝗰𝗲 𝗰𝗲𝗻𝘁𝗲𝗿 𝗳𝗼𝗿 𝘁𝗵𝗲 𝘁𝗲𝘀𝘁𝗶𝗻𝗴 𝗮𝗻𝗱 𝗿𝗲𝗹𝗶𝗮𝗯𝗶𝗹𝗶𝘁𝘆 𝗮𝘀𝘀𝗲𝘀𝘀𝗺𝗲𝗻𝘁 𝗼𝗳 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿𝘀 𝗶𝗻 𝗖𝗵𝗲𝗺𝗻𝗶𝘁𝘇.   Today, the Saxon State Minister for Science, Culture and Tourism, Sebastian Gemkow, handed over the two grant notifications for the new competence center – the “𝗧𝗲𝘀𝘁 𝗮𝗻𝗱 𝗥𝗲𝗹𝗶𝗮𝗯𝗶𝗹𝗶𝘁𝘆 𝗖𝗲𝗻𝘁𝗲𝗿” (𝗧𝗥𝗖) – to our institute director Prof. Harald Kuhn in the presence of the Saxon State Minister for Regional Development, Thomas Schmidt, in Dresden. Our colleagues Heiko Maier, who was responsible for the conceptual work on the TRC, and Dr. Alexander Weiß, who accompanies the TRC scientifically, also took part in the handover on site.   The investment is supported with 𝟵,𝟱𝟭 𝗺𝗶𝗹𝗹𝗶𝗼𝗻 𝗲𝘂𝗿𝗼𝘀 from the European Regional Development Fund (ERDF) and the "Just Transition" Fund (JTF).   This will further advance research and development in the field of testing and reliability assessment of semiconductor components and contribute to increasing the economic attractiveness of Saxony and securing the European independence in semiconductor production.   To this end, the TRC will pool important competencies in the field of testing and reliability, train tomorrow´s specialists with the new "Design and Test for Integrated Circuits" degree program at the Technische Universität Chemnitz, and enable the establishment of regional service providers in the field of testing and reliability.   We are excited about this great opportunity, which will further advance the testing and reliability assessment of semiconductors in our home town of Chemnitz and in Saxony, and we are already looking forward to the future with excitement.   Further information and details can be found in our latest press release (available in German): https://lnkd.in/esRNWMnw   In the picture: From left to right: Sebastian Gemkow (Saxon State Minister for Science, Culture and Tourism), Dr. Alexander Weiß, Prof. Dr. Harald Kuhn and Heiko Maier (Fraunhofer ENAS) as well as Thomas Schmidt (Saxon State Minister for Regional Development).   #FraunhoferENAS #Fraunhofer #Semiconductor #Test #Reliability Sächsisches Staatsministerium für Wissenschaft, Kultur und Tourismus Sächsisches Staatsministerium für Regionalentwicklung

Last week, the packaging community met for the 𝟭𝟬𝘁𝗵 𝗜𝗘𝗘𝗘 𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰𝘀 𝗦𝘆𝘀𝘁𝗲𝗺 𝗜𝗻𝘁𝗲𝗴𝗿𝗮𝘁𝗶𝗼𝗻 𝗧𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝘆 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 (𝗜𝗘𝗘𝗘 𝗘𝗦𝗧𝗖 𝟮𝟬𝟮𝟰) in Berlin. Of course, we as Fraunhofer ENAS and experts in this field could not miss this important European event for electronic packaging and system integration to present our latest research activities and to discuss current topics and trends with professionals and industry representatives. We had a successful time in our vibrant capital city with lots of contacts and great conversations.   You didn't make it to Berlin last week? More information about our expertise in the field of packaging technologies can be found on our website https://lnkd.in/exMXS4ZC. You are also welcome to contact us directly.   #ESTC #Electronics #Microelectronics #Packaging #AdvancedPackaging #SystemIntegration

At Fraunhofer ENAS we understand the transformative potential of microelectronics in shaping our future and pushing the boundaries of what’s possible across numerous fields. One sector where electronic systems can have a meaningful impact is healthcare, as they not only offer new options for health monitoring but also innovate medical care solutions.   This innovation potential was the topic of this week’s 𝗦𝗘𝗠𝗘𝗖𝗢 𝗽𝗿𝗼𝗷𝗲𝗰𝘁 𝗺𝗲𝗲𝘁𝗶𝗻𝗴 (Secure Medical Electronics and Communications) in Dresden, Germany. It was directly followed by the “𝗔𝗜 𝗮𝗻𝗱 𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰𝘀 𝗳𝗼𝗿 𝗠𝗲𝗱𝗶𝗰𝗶𝗻𝗲” 𝗰𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲, where from the 12th – 13th, healthcare professionals, industry experts and research specialists explored the future of medicine that integrates AI and electronics. Our colleagues, Dr. Mario Baum and Florian Glauche, were also present to talk about a new approach to expanding the functions of cochlea implants and other future implants.   By integrating EEG signals as markers for attention, perception and speech comprehension, the goal is to make the implant more intelligent to enable the focused suppression of interfering noise. This way, the implant would be able to mimic the ability of normally functioning hearing abilities to “zoom in” on certain conservations, while subconsciously blocking other sounds, e. g., the ticking of a clock.   In collaboration with experts from Technische Universität Dresden, FAU Erlangen-Nürnberg, MED-EL and our neighbor, EDC Electronic Design Chemnitz GmbH, Fraunhofer ENAS contributes to the venture by developing a highly miniaturized and biocompatible encapsulation method for medical implants and implantable components. Combining different layers in order to create an ultra-barrier, the envisioned layer system will not only protect the integrated sensors from bodily fluids but also act as an electromagnetic shield, ensuring optimal protection without having to rely on a traditional housing. With traditional housings being relatively space intensive, this solution allows for a higher degree of miniaturization of the implant and thus ensures greater patient comfort.   We are proud to be at the forefront of these revolutionary developments and look forward to the future advancements in medical technology.   Would you like to find out more about our system packaging solutions? Check out our website: https://lnkd.in/e4Yva_kn   #FraunhoferENAS #Fraunhofer #Semiconductor #Microelectronics #HealthcareInnovation #CochlearImplants #Collaboration #Research #Biocompatibility

For sensors to work ideally, protecting them from disruptive elements is crucial, as contaminants such as dust, moisture, or gas molecules might impede their operation. This is why encapsulation processes are a critical aspect in both sensor production and application. Vacuums can be used to greatly minimize such disruptive factors, allowing for optimal sensor function.   However, not all vacuums are the same, as their pressure range and attributed characteristics vary. Pressure ratios below 10⁻⁷ Pa are summarized under the term ultra-high vacuums (UHV) and contain so few molecules that their interactions with each other are minimal. Therefore, such UHV are ideally suited for sensor solutions because the function of the sensors is not disrupted by air damping or molecular deposits, leading to higher performance and long-term stability.   Our colleague Fiete Stoll will dedicate the next four years to explore methods to optimize encapsulation processes of micromechanical elements to generate ultra-high vacuums during his PhD research at Fraunhofer ENAS in collaboration with the TU Bergakademie Freiberg (TU BAF). Building on the expertise of both partners, he will look at ultra-high vacuum encapsulation from various perspectives. “One possible method of generating such vacuums is by using so-called ´getter materials´ in order to further minimize free-floating molecules. As they chemically react with certain gases in the vacuum chamber, they can effectively bind them and thus contribute to generating as well as maintaining ultra-high vacuums”, Fiete Stoll explains. He is excited about the opportunities the collaboration provides: “I am looking forward to combining the know-how the TU Bergakademie Freiberg has to offer in the field of material research with the expertise of Fraunhofer ENAS in bonding processes in order to explore optimization potentials of wafer-level encapsulation processes regarding the challenges of high-vacuum generation.”   This project could thus substantially contribute not only to the optimization of sensor development and application but also open new opportunities for other fields of research profiting from ultra-high vacuums, such as quantum mechanics.   We would like to thank the Sächsische Aufbaubank - Förderbank - for supporting this doctoral project between Fraunhofer ENAS and the Institute for Nanoscale and Biobased Materials at TU Bergakademie Freiberg with the ESF-Plus grant, which is additionally funded by the European Social Fund of the European Union and Freistaat Sachsen.   If you would like to learn more about our packaging solutions, check out our website: https://lnkd.in/eTn7XMMm   #FraunhoferENAS #Fraunhofer #TUBAF #UHV #UltrahHighVacuum #Vacuum #Sensor #Sensors #Bonding #PhD #Research