Our team has an immediate permanent opening for an Engineer.
Responsibilities:
Responsible for advancing packaging technology for RF System in Package (SIP) applications, including SMT, wirebonding, molding, solder ball attachment, strip grinding, and EMI shielding
Create, conduct, and analyze Design of Experiments (DOE) for the purpose of developing and sustaining programs
Responsible for collaborating with the engineering team in the development of new products
Job requirements
What you’ll bring to the team:
PHD in Electrical/Electronic Engineering with emphasis on RF and Microwave IC’s
Experience with the RF circuit design process
Understanding of all aspects of the hardware development cycle including requirements, architecture, simulation, schematic capture, PCB layout, power/thermal design, signal integrity, verification and manufacturing
Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)
Experience with AutoCad is desired, experience with Solidworks is an asset
Seniority level
Entry level
Employment type
Full-time
Job function
Engineering and Information Technology
Industries
Telecommunications
Referrals increase your chances of interviewing at Huawei Canada by 2x